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AFE3256TFV is listed in the Analog Front End (AFE) range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is 256-CHANNEL ANALOG FRONT END (AF. Review the specifications below when checking this part for your BOM.
The AFE3256TFV is a 256-channel analog front-end (AFE) designed for flat-panel detector-based digital X-ray systems. It integrates 256 integrators, correlated double samplers with dual banking, and a 256:2 analog multiplexer. The device features two 16-bit successive-approximation register (SAR) ADCs with serial LVDS output. Operating on a single 1.85V supply, it delivers 440 electrons RMS noise and ±2 LSB integral nonlinearity at 16 bits. Scan times range from less than 16 μs to 204.8 μs. The component utilizes a custom chip-on-film package measuring 48mm x 17.33mm.
Verify the specific ordering suffix 'TFV' against the Package Option Addendum to confirm the COF package type and pin count. Confirm that the required carrier quantity matches the JEDEC TRAY specification listed in the orderable information section. Ensure the operating temperature range of 0°C to 70°C aligns with system requirements before procurement.
Select the AFE3256TFV when a 48mm x 17.33mm COF footprint is required instead of the standard 38mm x 28mm TFU variant. Verify compatibility with the internal timing generator and pipelined integrate-and-read functionality for throughput optimization. Ensure the design supports the single 1.85V supply scheme and LVDS interface requirements.
The AFE3256 series serves as a readout integrated circuit (ROIC) for digital X-ray imaging systems. The TFV suffix specifically denotes a custom chip-on-film package configuration distinct from the TFU variant. Both variants share identical electrical specifications but differ in physical dimensions and pin counts to accommodate different detector panel layouts.
The AFE3256TFU is a direct functional alternative within the same family, differing only in package dimensions (38mm x 28mm vs 48mm x 17.33mm). Verify mechanical fit and pin mapping compatibility before substitution.
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