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The AFS090-1FG256I is a mixed-signal Field Programmable Gate Array (FPGA) from the Microsemi Fusion family, manufactured using an advanced 130-nm flash-based CMOS process. It integrates 90,000 system gates and 2,304 D-flip-flops within a Fine Pitch Ball Grid Array (FG256) package featuring a 1.0 mm pitch and 256 terminals. The device supports industrial temperature operation ranging from -40°C to +100°C. Key integrated resources include one 2 Mbit Flash Memory Block, 27 kbits of SRAM, and five Analog Quads providing up to 15 analog input channels. It operates on a single 3.3 V supply with an internal 1.5 V regulator and delivers system performance up to 350 MHz.
Verify the specific ordering suffixes to confirm the package type, speed grade, and temperature range match the design requirements. Ensure that the required IP licenses for cryptography are included if AES encryption is utilized in the final implementation. Confirm availability status as production quantities may vary over time.
Select this device when a compact solution combining digital programmability with analog signal processing is required. The FG256 package offers a balance of I/O count and board space efficiency. Consider the AFS090 model for lower density needs compared to higher-end Fusion devices like the AFS600 or AFS1500.
This component belongs to the Microsemi Fusion family of mixed-signal FPGAs, which merges flash-based FPGA fabric with embedded memory and analog peripherals. The AFS090 represents the entry-level density option within this series, designed to provide cost-effective integration for applications that previously required discrete analog components alongside standard FPGAs.
Devices such as the AFS090-1FG256 and AFS090-2FG256 offer alternative speed grades or commercial temperature ranges. Higher-density variants like the AFS250 or AFS600 provide increased logic resources but maintain pin compatibility in certain packages.