AFS090-1FGG256

AFS090-1FGG256

$44.75
  • Description:IC FPGA 75 I/O 256FBGA
  • Series:Fusion®

SKU:f498819f9865 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA 75 I/O 256FBGA
  • Series:Fusion®
  • Mfr:Microsemi Corporation
  • Package:Tray
  • Number of LABs/CLBs:-
  • Number of Logic Elements/Cells:-
  • Total RAM Bits:27648
  • Number of I/O:75
  • Voltage - Supply:1.425V ~ 1.575V
  • Mounting Type:Surface Mount
  • Operating Temperature:0°C ~ 85°C (TJ)
  • Package / Case:256-LBGA
  • Supplier Device Package:256-FPBGA (17x17)
  • Number of Gates:90000

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AFS090-1FGG256

Overview

The AFS090-1FGG256 is a Fusion mixed signal FPGA featuring 90,000 system gates and 2,304 tiles. It utilizes an advanced 130-nm flash-based CMOS process with seven layers of metal. The device includes 2 Mbits of user flash memory and 1 Kbit of FlashROM. Integrated analog resources comprise a 12-bit ADC supporting up to 30 channels at 600 Ksps and five Analog Quads with gate driver outputs. Clocking is provided by six Clock Conditioning Circuits (CCCs) with one integrated PLL. The FG256 package offers 75 single-ended or 22 differential I/Os. It operates from a single 3.3 V supply with an on-chip 1.5 V regulator.

Feature Summary

  • Instant On nonvolatile flash architecture eliminates external boot PROMs and provides immunity to firm errors.
  • Integrated mixed-signal capabilities include a high-voltage tolerant ADC and MOSFET gate drivers for direct power management.
  • Advanced security features utilize FlashLock and 128-bit AES encryption to protect intellectual property during in-system programming.

Applications

  • Power management systems requiring integrated monitoring and control
  • Smart battery charging applications with analog supervision
  • Clock generation and distribution networks using Instant On capabilities

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current product status documentation. Confirm that the requested package variant matches the required pin count and thermal specifications. Ensure the selected speed grade aligns with the target system timing requirements before finalizing procurement orders.

Selection Notes

Select this component when a single-chip solution combining digital logic with analog power control is required. The AFS090 density suits designs needing moderate logic capacity alongside significant analog integration. Consider the FG256 package constraints regarding available I/O banks and routing resources for complex mixed-signal layouts.

Part Context

This part belongs to the Microsemi Fusion family of mixed signal FPGAs. It shares architectural similarities with higher-density models like the AFS250 and AFS600 but offers reduced logic capacity. The device is designed as a cost-effective alternative to discrete analog components and ASICs for system management tasks.

Replacement Considerations

Devices within the same package type across the Fusion family, such as the AFS250, may offer pin compatibility. Verify electrical characteristics and resource availability when substituting with other members of the ProASIC3 or SmartFusion families.

AFS090-1FGG256AFS090-1FGG256
$44.75
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