AFS090-2FGG256I

AFS090-2FGG256I

$84.28
  • Description:IC FPGA 75 I/O 256FBGA
  • Series:Fusion®

SKU:7c7aa0cf78bf Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA 75 I/O 256FBGA
  • Series:Fusion®
  • Mfr:Microsemi Corporation
  • Package:Tray
  • Number of LABs/CLBs:-
  • Number of Logic Elements/Cells:-
  • Total RAM Bits:27648
  • Number of I/O:75
  • Voltage - Supply:1.425V ~ 1.575V
  • Mounting Type:Surface Mount
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:256-LBGA
  • Supplier Device Package:256-FPBGA (17x17)
  • Number of Gates:90000

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AFS090-2FGG256I

Overview

The AFS090-2FGG256I is a mixed-signal Field Programmable Gate Array from the Microsemi Fusion family, manufactured using an advanced 130-nm flash-based CMOS process. It provides 90,000 system gates and 2,304 VersaTiles within a Fine Pitch Ball Grid Array (FG) package featuring a 1.0 mm pitch and 256 terminals. The device supports a maximum system performance of 350 MHz and includes 2 Mbits of embedded user flash memory alongside 1 Kbit of FlashROM. Integrated analog resources consist of five Analog Quads, supporting up to 15 ADC input channels with 12-bit resolution at speeds up to 600 Ksps. The component operates across an industrial temperature range of -40°C to +100°C.

Feature Summary

  • Integrates nonvolatile flash FPGA fabric with embedded analog peripherals for single-chip mixed-signal solutions.
  • Features high-voltage tolerant analog inputs capable of handling signals from -10.5 V to +12 V.
  • Includes integrated MOSFET gate driver outputs with programmable drive strengths for power management applications.
  • Supports Instant On operation without external configuration boot PROMs.

Applications

  • Power management systems and smart battery charging circuits
  • Motor control applications requiring mixed-signal processing
  • Clock generation and management in communication equipment
  • Industrial and avionics system supervision

Procurement Notes

Verify the specific ordering suffixes against official Microsemi documentation to confirm speed grade, package type, and security features. Ensure compatibility with Libero SoC software tools for design implementation. Confirm RoHS compliance status and lead-free packaging requirements prior to procurement.

Selection Notes

Select this device for designs requiring low-density logic combined with significant analog integration. The AFS090 offers sufficient resources for supervisory functions and simple motor control. Consider higher-density Fusion devices if more system gates or additional analog channels are required.

Part Context

This component belongs to the Microsemi Fusion family of mixed-signal FPGAs, which combines flash-based programmable logic with on-chip analog blocks. The family targets applications needing high reliability, security, and reduced bill-of-materials by replacing discrete components. The AFS090 represents the entry-level density option within this architecture.

Replacement Considerations

Direct pin-compatible replacements exist within the same FG256 package footprint across the Fusion family, such as the AFS250 or AFS600, provided logic capacity and I/O counts meet design requirements. Verify that any substitute maintains the necessary analog channel count and speed grade specifications.

AFS090-2FGG256IAFS090-2FGG256I
$84.28
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