AFS090-FG256I

Overview

The AFS090-FG256I is a Fusion mixed-signal FPGA featuring 90,000 system gates and 2,304 tiles. It utilizes a 130-nm flash-based CMOS process with seven metal layers. The device includes 2 Mbits of user flash memory, 1 Kbit of FlashROM, and 27 kbits of SRAM. An integrated 12-bit ADC supports up to 15 analog input channels with a maximum sampling rate of 600 Ksps. It operates from a single 3.3 V supply with an on-chip 1.5 V regulator. The FG256 package provides 75 digital I/Os and 22 analog I/Os in a 256-ball FBGA format. The industrial temperature grade (-40°C to +100°C) ensures reliable operation in harsh environments.

Feature Summary

• Instant On nonvolatile flash technology eliminates the need for external boot PROMs and configuration components.
• Integrated mixed-signal capabilities include a 12-bit ADC, MOSFET gate drivers, and high-voltage tolerant analog inputs.
• Advanced security features utilize 128-bit AES encryption and FlashLock to protect intellectual property during in-system programming.
• Single 3.3 V power supply architecture with an internal voltage regulator simplifies board design and reduces component count.

Applications

• Power management systems and smart battery chargers
• Motor control applications requiring integrated analog sensing
• Clock generation and management circuits
• System supervisor and monitoring functions

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current product catalog to confirm availability and exact specifications. Ensure the selected package variant matches the required pinout and thermal characteristics for the target application. Cross-reference the datasheet revision date to confirm compliance with current manufacturing standards and lead times.

Selection Notes

Select this model when a compact FPGA solution requires integrated analog peripherals such as ADCs and gate drivers. The 90,000-gate density is suitable for moderate complexity logic designs. Consider the industrial temperature range if the operating environment exceeds standard commercial limits. Verify that the 256-ball package fits within the available PCB area constraints.

Part Context

This component belongs to the Microsemi Fusion family of mixed-signal FPGAs. It shares architectural similarities with other devices in the series, such as the AFS250 and AFS600, but offers lower logic density. The Fusion family is characterized by its instant-on flash technology and integrated analog blocks, distinguishing it from standard SRAM-based FPGAs.

Replacement Considerations

Compatible substitutes within the same family include the AFS090-1FG256I or AFS090-2FG256I for different speed grades. For higher performance requirements, consider the AFS250-FG256I. Ensure pin compatibility and verify that the alternative part number meets the specific temperature and security feature requirements of the original design.