AFS090-FGG256

AFS090-FGG256

$41.18
  • Description:IC FPGA 75 I/O 256FBGA
  • Series:Fusion®

SKU:8b41c396092d Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA 75 I/O 256FBGA
  • Series:Fusion®
  • Mfr:Microsemi Corporation
  • Package:Tray
  • Number of LABs/CLBs:-
  • Number of Logic Elements/Cells:-
  • Total RAM Bits:27648
  • Number of I/O:75
  • Voltage - Supply:1.425V ~ 1.575V
  • Mounting Type:Surface Mount
  • Operating Temperature:0°C ~ 85°C (TJ)
  • Package / Case:256-LBGA
  • Supplier Device Package:256-FPBGA (17x17)
  • Number of Gates:90000

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AFS090-FGG256

Overview

The Microsemi AFS090-FGG256 is a mixed-signal Field Programmable Gate Array (FPGA) from the Fusion family, manufactured using an advanced 130-nm, 7-layer metal flash-based CMOS process. It provides 90,000 system gates and 2,304 VersaTiles. The device integrates 2 Mbits of user Flash memory, 1 Kbit of FlashROM, and 27 kbits of SRAM. Key analog features include up to 30 scalable ADC input channels with 12-bit resolution at 600 Ksps, high-voltage I/O tolerance (-10.5 V to +12 V), and up to 10 MOSFET gate driver outputs. It operates on a single 3.3 V supply with an internal 1.5 V regulator.

Feature Summary

  • Instant On capability due to nonvolatile flash configuration, eliminating external boot PROMs.
  • Integrated mixed-signal architecture combining FPGA fabric, flash memory, and analog peripherals.
  • High-voltage tolerant I/O supporting -10.5 V to +12 V for direct sensor interfacing.
  • Built-in AES decryption engine and FlashLock technology for secure in-system programming.

Applications

  • Power management systems
  • Smart battery charging controllers
  • Clock generation and management
  • Motor control applications

Procurement Notes

Verify the specific suffix codes against the official datasheet to confirm speed grade, package type, and temperature range. Ensure the ordering code matches the required security license status and RoHS compliance level. Cross-reference the part number with the manufacturer's current product catalog to confirm production status and availability.

Selection Notes

Select this device for designs requiring high-density logic combined with analog signal processing and nonvolatile storage. Consider the FG256 package constraints regarding available I/O banks and pin count. Evaluate if the 90,000 system gate capacity meets the design complexity requirements compared to higher-density Fusion family members.

Part Context

This component belongs to the Microsemi Fusion family of mixed-signal FPGAs. It shares architectural similarities with other Fusion devices like the AFS250 and AFS600 but offers lower logic density. The FG256 package is a Fine Pitch Ball Grid Array compatible with other Fusion devices in the same footprint.

Replacement Considerations

Compatible replacements within the same package include other AFS090 variants with different speed grades or temperature ratings, such as AFS090-1FGG256 or AFS090-I. Higher density Fusion devices may require schematic modifications.

AFS090-FGG256AFS090-FGG256
$41.18
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