AFS1500-2FGG484I

AFS1500-2FGG484I

$821.24
  • Description:IC FPGA 223 I/O 484FBGA
  • Series:Fusion®

SKU:b36b69613ab3 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA 223 I/O 484FBGA
  • Series:Fusion®
  • Mfr:Microchip Technology
  • Package:Tray
  • Number of LABs/CLBs:-
  • Number of Logic Elements/Cells:-
  • Total RAM Bits:276480
  • Number of I/O:223
  • Voltage - Supply:1.425V ~ 1.575V
  • Mounting Type:Surface Mount
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:484-BGA
  • Supplier Device Package:484-FPBGA (23x23)
  • Number of Gates:1500000

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AFS1500-2FGG484I

Overview

The AFS1500-2FGG484I is a Fusion FPGA from Microchip Technology, featuring 1.5 million system gates and an integrated ARM Cortex-M1 processor. It utilizes a 484-pin FBGA package with a 1.0 mm pitch and measures 23 x 23 mm. The device operates at a maximum frequency of 1.47 GHz with I/O counts of 223. Power supply requirements range from 1.425 V to 1.575 V, centered on 1.5 V. The component supports industrial temperature ranges from -40°C to +85°C and includes humidity sensitivity features for standard surface-mount assembly.

Feature Summary

  • Integrates an ARM Cortex-M1 processor within the FPGA fabric for embedded control applications.
  • Provides high-density logic capacity with 1.5 million system gates for complex digital designs.
  • Supports high-speed operation with a maximum clock frequency of 1.47 GHz.

Applications

  • Industrial automation controllers requiring mixed-signal processing.
  • Automotive infotainment systems utilizing embedded RISC-V or ARM cores.
  • Telecommunications infrastructure equipment needing low-power reconfigurable logic.

Procurement Notes

Verify the specific suffix 'I' indicates the industrial temperature grade (-40°C to +85°C) as defined in the official datasheet. Confirm the package type is FBGA-484 with a 1.0 mm pitch. Check for any export control classifications or RoHS compliance status updates prior to ordering. Ensure compatibility with existing PCB footprints and soldering profiles for lead-free assembly processes.

Selection Notes

Select this model when a balance of high logic density and embedded processing is required. Compare against the M1AFS1500 series for similar gate counts but different package options. Consider the A3P1000 if lower power consumption is critical and higher speed is not needed. Evaluate the MPFS095T if RISC-V architecture is preferred over ARM Cortex-M1.

Part Context

This component belongs to the Microchip Fusion FPGA family, which combines SRAM-based FPGA fabric with embedded processors. It serves as a bridge between traditional ASICs and general-purpose FPGAs, offering non-volatile configuration capabilities through optional flash integration. The 484-pin FBGA package is common for mid-to-high density designs in compact form factors.

Replacement Considerations

The M1AFS1500-2FG484I offers identical functional specifications but uses a different pinout-compatible FBGA package variant. The AFS1500-FGG484K is a related part with similar gate count but may differ in temperature grade or packaging details. Verify pin-to-pin compatibility before substitution.

AFS1500-2FGG484IAFS1500-2FGG484I
$821.24
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