AFS250-1FGG256I

AFS250-1FGG256I

$177.93
  • Description:IC FPGA 114 I/O 256FBGA
  • Series:Fusion®

SKU:4bb1500fc317 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA 114 I/O 256FBGA
  • Series:Fusion®
  • Mfr:Microchip Technology
  • Package:Tray
  • Number of LABs/CLBs:-
  • Number of Logic Elements/Cells:-
  • Total RAM Bits:36864
  • Number of I/O:114
  • Voltage - Supply:1.425V ~ 1.575V
  • Mounting Type:Surface Mount
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:256-LBGA
  • Supplier Device Package:256-FPBGA (17x17)
  • Number of Gates:250000

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AFS250-1FGG256I

Overview

The AFS250-1FGG256I is a Fusion FPGA from Microchip Technology, featuring 250K system gates and 38,400 configurable logic blocks (CLBs). It operates within a supply voltage range of 1.425 V to 1.575 V at a nominal 1.5 V. The device supports up to 150 MHz maximum operating frequency and includes 150 I/O pins. It is housed in a 256-pin FBGA package with a 1 mm pitch, suitable for surface mount applications across an industrial temperature range of -40°C to +85°C.

Feature Summary

  • Integrates a hard ARM Cortex-M3 processor subsystem for embedded control tasks alongside programmable logic resources.
  • Provides non-volatile flash-based configuration technology ensuring immediate operation upon power-up without external memory.
  • Features a multi-layer AHB communications matrix designed to facilitate high-bandwidth data transfer between the processor and logic fabric.

Applications

  • Industrial automation controllers requiring deterministic logic processing and integrated microcontroller capabilities.
  • Automotive infotainment systems utilizing the embedded Ethernet MAC and high-speed I/O interfaces.
  • Aerospace and defense avionics benefiting from radiation-tolerant flash FPGA architecture and wide temperature operation.

Procurement Notes

Verify export compliance requirements prior to ordering, as this component may require additional documentation for international shipment depending on destination regulations. Confirm that the specific suffix matches the required temperature grade and package variant. Ensure handling procedures account for moisture sensitivity levels defined in the datasheet to prevent damage during assembly.

Selection Notes

Select this model when a system requires both high-density programmable logic and an integrated hard processor core. Compare against the U1AFS series if higher gate counts or different interface options are needed. Verify that the 256-pin FBGA footprint aligns with the target PCB design constraints and that the 1.5V core voltage is supported by the available power rails.

Part Context

This part belongs to the SmartFusion family of customizable system-on-chips (cSoCs), which merge Flash FPGA fabric with an ARM Cortex-M3 microcontroller subsystem. It represents a mid-range solution in the portfolio, offering a balance between logic density and embedded processing performance for complex mixed-signal applications.

Replacement Considerations

The M7AFS600-1FGG256I serves as a higher-performance alternative within the same Fusion family, offering increased gate count and processor speed. For legacy compatibility, verify pin-to-pin equivalence with older Actel or Microsemi parts, noting potential differences in I/O standards and power management features.

AFS250-1FGG256IAFS250-1FGG256I
$177.93
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