AFS250-FGG256

Overview

The AFS250-FGG256 is a Fusion FPGA from Microchip Technology, featuring 250K system gates and 114 I/Os. It operates on a 1.425V to 1.575V supply voltage within a commercial temperature range of 0°C to 85°C. The device utilizes a 256-LBGA package (17x17mm) and includes 36,864 bits of embedded RAM. It supports surface-mount installation and exhibits moisture sensitivity level 3.

Feature Summary

• Integrates MicroBlade Advanced Mezzanine architecture for high-density logic implementation
• Supports mixed-signal applications through the Fusion platform capabilities
• Provides configurable I/O interfaces compatible with various signaling standards

Applications

• Industrial automation control systems
• Telecommunications infrastructure equipment
• Automotive electronic modules

Procurement Notes

Verify RoHS compliance status as documentation indicates non-compliance in some sources. Confirm export restrictions may apply due to US trade regulations. Check manufacturing lead times which can extend up to twenty weeks. Ensure proper handling for moisture-sensitive devices upon receipt.

Selection Notes

Compare against U1AFS250 for updated feature sets or M1AFS250 for similar gate counts. Evaluate thermal requirements against the 85°C junction limit. Consider package availability and tray quantities of ninety units during design-in phases.

Part Context

This component belongs to the Fusion family of mixed-signal FPGAs. It shares the 256-pin BGA footprint with other variants like A3P250 but offers distinct architectural features. The part number suffix FG denotes the package type while 256 indicates pin count.

Replacement Considerations

U1AFS250-FG256I serves as a direct functional equivalent within the same series. M1AFS250-2FG256 offers comparable logic density with similar interface options.