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The AFS250-FGG256I is a Fusion FPGA from Microchip Technology, featuring 250K system gates. It operates within a supply voltage range of 1.425 V to 1.575 V and supports up to 119 I/Os. The device utilizes a 256-pin FBGA package and functions across an industrial temperature range of -40°C to +85°C. Key specifications include 36 kbit of embedded memory and a maximum operating frequency of 500 MHz.
Verify the specific suffix 'FGG256I' against official Microchip documentation to confirm package type, pinout, and commercial temperature rating. Ensure compliance with export regulations as this product may require additional documentation for international shipment. Confirm RoHS status directly with the manufacturer or authorized distributor, as listed attributes can vary by revision.
Compare gate count and I/O availability against alternative Fusion series devices like U1AFS250 or M1AFS250 to ensure optimal resource utilization. Evaluate power consumption requirements relative to the 1.5 V core voltage. Verify that the 256-pin FBGA footprint matches the PCB design constraints and thermal management strategy.
This component belongs to the Microchip Fusion FPGA family, which combines SRAM-based programmability with non-volatile memory features. The AFS250 variant targets applications requiring moderate logic density with low power consumption. It serves as a bridge between traditional ASICs and standard SRAM FPGAs in cost-sensitive designs.
Potential substitutes within the same package include U1AFS250-FGG256I and M1AFS250-2FG256. Verify functional equivalence regarding logic resources and I/O configurations before substitution.