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The AFS600-1FG484I is a Fusion field-programmable gate array manufactured by Microchip Technology. It features 13,824 configurable logic blocks and approximately 600,000 equivalent system gates. The device operates within an industrial temperature range of -40 °C to +85 °C and utilizes a 484-terminal plastic ball grid array package with a 1.0 mm pitch. It supports mixed-voltage I/O standards including 1.5 V, 1.8 V, 2.5 V, and 3.3 V, with a maximum system performance frequency of 350 MHz.
Verify the specific revision level and RoHS compliance status directly with the manufacturer or authorized distributors before procurement. Confirm that the required operating temperature range aligns with the industrial specification limits. Ensure that the design accounts for the specific moisture sensitivity level associated with the BGA packaging format during assembly processes.
Select this component when a high-density FPGA with integrated nonvolatile memory is required. Consider the 350 MHz performance limit and the availability of mixed-voltage I/O banks for interface compatibility. Evaluate the need for embedded analog functions if signal conditioning is necessary within the same silicon die.
This part belongs to the Microsemi Fusion family, which combines SRAM-based FPGA fabric with embedded flash memory. The series provides a single-chip solution that retains configuration data without external memory devices. This architecture simplifies board design by eliminating the need for separate configuration PROMs.
The M1AFS600-FFGG484 is a pin-compatible variant within the same product family. Verify functional equivalence regarding voltage levels and timing specifications before substitution.