AFS600-1FG484I

AFS600-1FG484I

$311.15
  • Description:IC FPGA 172 I/O 484FBGA
  • Series:Fusion®

SKU:1c796bd9c417 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA 172 I/O 484FBGA
  • Series:Fusion®
  • Mfr:Microchip Technology
  • Package:Tray
  • Number of LABs/CLBs:-
  • Number of Logic Elements/Cells:-
  • Total RAM Bits:110592
  • Number of I/O:172
  • Voltage - Supply:1.425V ~ 1.575V
  • Mounting Type:Surface Mount
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:484-BGA
  • Supplier Device Package:484-FPBGA (23x23)
  • Number of Gates:600000

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AFS600-1FG484I

Overview

The AFS600-1FG484I is a Fusion field-programmable gate array manufactured by Microchip Technology. It features 13,824 configurable logic blocks and approximately 600,000 equivalent system gates. The device operates within an industrial temperature range of -40 °C to +85 °C and utilizes a 484-terminal plastic ball grid array package with a 1.0 mm pitch. It supports mixed-voltage I/O standards including 1.5 V, 1.8 V, 2.5 V, and 3.3 V, with a maximum system performance frequency of 350 MHz.

Feature Summary

  • Advanced digital I/O supporting mixed-voltage operation across multiple banks
  • Nonvolatile flash-based technology enabling live at power-up functionality
  • Integrated security features including FlashLock for content protection

Applications

  • Industrial control systems requiring nonvolatile reprogrammability
  • Mixed-signal applications utilizing embedded analog components
  • Secure hardware designs requiring in-system programming capabilities

Procurement Notes

Verify the specific revision level and RoHS compliance status directly with the manufacturer or authorized distributors before procurement. Confirm that the required operating temperature range aligns with the industrial specification limits. Ensure that the design accounts for the specific moisture sensitivity level associated with the BGA packaging format during assembly processes.

Selection Notes

Select this component when a high-density FPGA with integrated nonvolatile memory is required. Consider the 350 MHz performance limit and the availability of mixed-voltage I/O banks for interface compatibility. Evaluate the need for embedded analog functions if signal conditioning is necessary within the same silicon die.

Part Context

This part belongs to the Microsemi Fusion family, which combines SRAM-based FPGA fabric with embedded flash memory. The series provides a single-chip solution that retains configuration data without external memory devices. This architecture simplifies board design by eliminating the need for separate configuration PROMs.

Replacement Considerations

The M1AFS600-FFGG484 is a pin-compatible variant within the same product family. Verify functional equivalence regarding voltage levels and timing specifications before substitution.

AFS600-1FG484IAFS600-1FG484I
$311.15
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