AFS600-FG484I

AFS600-FG484I

  • Description:IC FPGA 172 I/O 484FBGA
  • Series:Fusion®

SKU:d16bc6e52abb Category: Brand:

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Product Detailed Parameters

  • Description:IC FPGA 172 I/O 484FBGA
  • Series:Fusion®
  • Mfr:Microchip Technology
  • Package:Tray
  • Number of LABs/CLBs:-
  • Number of Logic Elements/Cells:-
  • Total RAM Bits:110592
  • Number of I/O:172
  • Voltage - Supply:1.425V ~ 1.575V
  • Mounting Type:Surface Mount
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:484-BGA
  • Supplier Device Package:484-FPBGA (23x23)
  • Number of Gates:600000

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AFS600-FG484I

Overview

The AFS600-FG484I is a Fusion field-programmable gate array manufactured by Microchip Technology. It features 13,824 configurable logic blocks and an equivalent of 600,000 system gates. The device operates within a temperature range of -40 °C to +85 °C and utilizes a 484-terminal plastic ball grid array package with a 1.0 mm pitch. Key electrical parameters include a maximum operating frequency of 350 MHz, support for mixed-voltage I/O standards at 1.5 V, 1.8 V, 2.5 V, and 3.3 V, and a single 3.3 V power supply requirement with an on-chip 1.5 V regulator.

Feature Summary

  • Nonvolatile flash-based technology enabling live-at-power-up functionality without external configuration memory.
  • Integrated analog subsystem featuring up to 30 scalable ADC input channels with high-voltage tolerance.
  • Secure in-system programming capabilities protected by FlashLock technology and AES encryption.

Applications

  • Industrial control systems requiring mixed-signal processing and nonvolatile reconfiguration.
  • Automotive infotainment and body electronics utilizing high-voltage tolerant inputs.
  • Telecommunications infrastructure employing secure FPGA contents and low-power standby modes.

Procurement Notes

Verify the specific suffix 'FGG' versus 'FG' against official datasheets, as pinout and thermal characteristics may differ between variants. Confirm RoHS compliance status directly with the manufacturer, as historical data indicates potential discrepancies for older production runs. Ensure the selected package matches the required PCB footprint dimensions and soldering profile specifications.

Selection Notes

Select this component when nonvolatile operation and integrated analog functions are required without external configuration devices. Compare logic density and I/O count against the M1AFS600 series if ARM processor integration is necessary. Evaluate the MPF200T series if higher-speed transceivers are needed instead of pure logic capacity.

Part Context

This part belongs to the Microsemi Fusion family, which combines SRAM-based FPGA fabric with embedded flash memory. The FG484 designation indicates a 484-pin BGA package suitable for high-density board layouts. It serves as a bridge between traditional SRAM FPGAs and lower-density flash FPGAs, offering mid-range performance with instant-on capabilities.

Replacement Considerations

The M1AFS600-FFGG484I is a pin-compatible variant that includes an integrated ARM Cortex-M3 processor core. Designers requiring additional processing capability should consider this upgrade while maintaining the same physical footprint and basic logic architecture.

AFS600-FG484IAFS600-FG484I

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