SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The AFS600-FG484I is a Fusion field-programmable gate array manufactured by Microchip Technology. It features 13,824 configurable logic blocks and an equivalent of 600,000 system gates. The device operates within a temperature range of -40 °C to +85 °C and utilizes a 484-terminal plastic ball grid array package with a 1.0 mm pitch. Key electrical parameters include a maximum operating frequency of 350 MHz, support for mixed-voltage I/O standards at 1.5 V, 1.8 V, 2.5 V, and 3.3 V, and a single 3.3 V power supply requirement with an on-chip 1.5 V regulator.
Verify the specific suffix 'FGG' versus 'FG' against official datasheets, as pinout and thermal characteristics may differ between variants. Confirm RoHS compliance status directly with the manufacturer, as historical data indicates potential discrepancies for older production runs. Ensure the selected package matches the required PCB footprint dimensions and soldering profile specifications.
Select this component when nonvolatile operation and integrated analog functions are required without external configuration devices. Compare logic density and I/O count against the M1AFS600 series if ARM processor integration is necessary. Evaluate the MPF200T series if higher-speed transceivers are needed instead of pure logic capacity.
This part belongs to the Microsemi Fusion family, which combines SRAM-based FPGA fabric with embedded flash memory. The FG484 designation indicates a 484-pin BGA package suitable for high-density board layouts. It serves as a bridge between traditional SRAM FPGAs and lower-density flash FPGAs, offering mid-range performance with instant-on capabilities.
The M1AFS600-FFGG484I is a pin-compatible variant that includes an integrated ARM Cortex-M3 processor core. Designers requiring additional processing capability should consider this upgrade while maintaining the same physical footprint and basic logic architecture.