RF Amplifiers AFSC5G23E39T2 product image

AFSC5G23E39T2

$21.39
  • Description:AIRFAST POWER AMPLIFIER MODULE,
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)

SKU:ef9bbbae0b55 Category: Brand:

  
  • Quantity
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AFSC5G23E39T2 is listed in the RF Amplifiers range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is AIRFAST POWER AMPLIFIER MODULE,. Review the specifications below when checking this part for your BOM.

RF Amplifiers specifications for AFSC5G23E39T2

  • Description:AIRFAST POWER AMPLIFIER MODULE,
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)
  • Frequency:-
  • P1dB:-
  • Gain:-
  • Noise Figure:-
  • RF Type:-
  • Voltage - Supply:-
  • Current - Supply:-
  • Test Frequency:-
  • Mounting Type:Surface Mount
  • Package / Case:26-LQFN Exposed Pad
  • Supplier Device Package:26-HLQFN (10x6)
  • Grade:-
  • Qualification:-

RF Amplifiers datasheet and documents for AFSC5G23E39T2

AFSC5G23E39T2

RF Amplifiers Overview

The AFSC5G23E39T2 is a fully integrated Doherty power amplifier module designed for wireless infrastructure applications. It operates within the 2300–2400 MHz frequency range, delivering an average output power of 8 W with a gain of 30 dB. The device utilizes LDMOS technology and requires a 28 V supply voltage. It is housed in a compact 10 x 6 mm 26-HLQFN package. This component is engineered to provide high efficiency and linearity for base station transmitter stages.

RF Amplifiers Feature Summary

  • Fully integrated Doherty architecture for enhanced efficiency
  • High average output power capability of 8 W
  • Compact surface-mount packaging design

RF Amplifiers Applications

  • Wireless infrastructure base stations
  • Broadband communication systems
  • LTE/4G transmitter modules

RF Amplifiers Procurement Notes

Verify current availability status as this part may be subject to end-of-life restrictions or obsolescence notices from NXP Semiconductors. Confirm that the specific suffix T2 matches the required tape-and-reel configuration if applicable. Ensure compatibility with existing thermal management solutions due to the power density of the LDMOS die. Cross-reference the exact package dimensions against the PCB footprint to avoid assembly errors. Request official lifecycle documentation to assess long-term supply chain risks before finalizing procurement decisions.

RF Amplifiers Selection Notes

Select this module when designing for the 2300–2400 MHz band requiring high linearity and efficiency. The Doherty topology suits applications demanding peak back-off performance. Consider the 28 V operating voltage and thermal requirements during system integration. Evaluate the 10 x 6 mm package size against board space constraints. Compare against alternative amplifiers if different frequency bands or power levels are needed.

RF Amplifiers Part Context

This component belongs to NXP's Airfast series of power amplifier modules. These modules are specifically engineered for cellular infrastructure, offering a balance of performance and integration. The AFSC5G23E39 variant targets specific broadband standards, providing a complete solution including matching networks and protection circuits within a single package.

RF Amplifiers Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. As the product is listed as End of Life, direct replacements must be sourced through official NXP channels or verified third-party distributors. Designers should consult NXP for recommended next-generation alternatives compatible with the same form factor and electrical specifications.

AFSC5G23E39T2AFSC5G23E39T2
$21.39
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