AGFA006R24C3I3E

Soc System On Chip Overview

The AGFA006R24C3I3E is an FPGA from the Agilex 7 F-Series, manufactured by Altera. It features 573,000 logic elements and operates within a temperature range of -40°C to 100°C TJ. The device utilizes a Tray packaging format and carries a Moisture Sensitivity Level (MSL) rating of 3, corresponding to 168 hours. This component belongs to the programmable logic ICs subcategory.

Soc System On Chip Feature Summary

• Integrates into the Agilex 7 F-Series architecture for high-density programmable logic applications
• Supports industrial operating temperatures with specified thermal junction limits
• Designed for system integration with standardized packaging options

Soc System On Chip Applications

• High-performance digital signal processing systems
• Industrial automation control units
• Telecommunications infrastructure hardware
• Test and measurement equipment logic cores

Soc System On Chip Procurement Notes

Verify availability status through authorized distributors as supply may be restricted in certain regions. Confirm RoHS compliance details directly with the manufacturer or official documentation before procurement. Ensure handling procedures account for the specified moisture sensitivity level to prevent damage during storage and assembly processes.

Soc System On Chip Selection Notes

Select this model when 573K logic elements are required within the Agilex 7 ecosystem. Consider the R24 package dimensions and I/O count for board layout compatibility. Evaluate thermal management requirements against the 100°C TJ limit for industrial environments.

Soc System On Chip Part Context

This part is a specific variant within the Agilex 7 F-Series family, identified by the AGF006 designation. It represents a mid-range density option in the portfolio, distinct from higher-capacity models like the AGFA027 series. The suffix indicates specific performance grades and package configurations defined by Altera.