AGFA027R24C2E1VB

AGFA027R24C2E1VB

$26,643.45
  • Description:IC FPGA AGILEX-F 2340BGA
  • Series:Agilex F

SKU:05f2a2e47e1f Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA AGILEX-F 2340BGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 2.7M Logic Elements
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:2340-BFBGA Exposed Pad
  • Supplier Device Package:2340-BGA (45x42)

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AGFA027R24C2E1VB

Overview

The AGFA027R24C2E1VB is an Agilex F-series System on Chip FPGA featuring a quad-core ARM Cortex-A53 processor with CoreSight, NEON, and floating-point units. It integrates approximately 2.7 million logic elements and includes 256KB of embedded RAM. The device operates at speeds up to 1.4GHz and provides 720 I/Os within a 3184-BGA package measuring 56x45mm. It supports standard peripherals including Ethernet, USB OTG, SPI, and UART.

Feature Summary

  • Integrated quad-core ARM Cortex-A53 MPCore processor with NEON and floating-point capabilities
  • High-density programmable fabric with approximately 2.7 million logic elements
  • Support for diverse connectivity interfaces including Ethernet, USB OTG, and MMC/SD

Applications

  • Industrial automation controllers requiring mixed processing and logic
  • Network infrastructure equipment utilizing integrated Ethernet and high-speed I/O
  • Embedded systems demanding combined CPU and FPGA flexibility

Procurement Notes

Verify the specific suffix codes against official Altera documentation to confirm electrical grade and package variations. Confirm moisture sensitivity level (MSL) requirements prior to assembly. Ensure ECAD models are updated from official sources to match current pin definitions. Check for any recent product change notices regarding labeling or design revisions before finalizing procurement specifications.

Selection Notes

Select this model when a combination of ARM processing power and substantial FPGA resources is required in a compact form factor. Compare I/O counts and package dimensions against system board constraints. Evaluate thermal performance requirements given the BGA packaging and operating temperature range. Consider the availability of IBIS models for signal integrity analysis during the design phase.

Part Context

This component belongs to the Agilex 7 F-Series family, designed for applications needing scalable performance. It combines hard processor systems with configurable logic, offering a unified platform for complex embedded designs. The series supports various packaging options to accommodate different density and pin count requirements across industrial and communication sectors.

Replacement Considerations

Consult official manufacturer substitution guides for verified alternatives. Cross-reference pinouts and electrical characteristics carefully when considering similar Agilex devices. Verify that any substitute maintains compatibility with existing software toolchains and hardware interfaces.

AGFA027R24C2E1VBAGFA027R24C2E1VB
$26,643.45
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