AGFA027R25A2I2V

AGFA027R25A2I2V

$23,027.36
  • Description:IC FPGA AGILEX-F 2581FBGA
  • Series:Agilex F

SKU:dc694c2bcbc5 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA AGILEX-F 2581FBGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 2.7M Logic Elements
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:-
  • Supplier Device Package:-

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AGFA027R25A2I2V

Overview

The AGFA027R25A2I2V is an Agilex F Series System on Chip FPGA featuring a quad-core ARM Cortex-A53 processor with CoreSight, NEON, and floating-point units. It integrates 2.7 million logic elements within a 2581-ball FBGA package. The device supports a maximum operating frequency of 1.4GHz and includes 256KB of embedded RAM. It provides 624 I/Os and operates across a junction temperature range of -40°C to 100°C.

Feature Summary

  • Integrated quad-core ARM Cortex-A53 MPCore processor with CoreSight debug capabilities
  • High-performance FPGA fabric with 2.7 million logic elements
  • Support for high-speed connectivity including Ethernet and USB OTG
  • Optimized for low power consumption in compact form factors

Applications

  • Industrial automation controllers requiring real-time processing
  • Medical imaging systems needing high throughput and low latency
  • Telecommunications infrastructure equipment
  • Automotive infotainment and advanced driver assistance systems

Procurement Notes

Verify the specific suffix codes against official Intel/Altera documentation to ensure correct package type and temperature grade. Confirm moisture sensitivity level (MSL 3) handling requirements during assembly. Check for any recent Product Change Notices regarding labeling or design revisions that may affect compatibility with existing board designs.

Selection Notes

Select this component when a combined CPU and FPGA solution is required for complex signal processing tasks. Ensure the design accommodates the 2581-ball FBGA footprint and thermal dissipation needs for the 100°C junction limit. Compare logic density and I/O count against alternative Agilex F models to optimize cost and performance balance.

Part Context

This part belongs to the Agilex F series, designed for mid-range applications balancing performance and power efficiency. It succeeds previous generations by offering improved DSP capabilities and higher I/O bandwidth. The Agilex family targets markets demanding flexible hardware acceleration alongside software programmability.

AGFA027R25A2I2VAGFA027R25A2I2V
$23,027.36
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