AGFB006R16A2E3V

AGFB006R16A2E3V

$6,080.94
  • Description:IC FPGA AGILEX-F 1546FBGA
  • Series:Agilex F

SKU:a5bd82801564 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA AGILEX-F 1546FBGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 573K Logic Elements
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:-
  • Supplier Device Package:-

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AGFB006R16A2E3V

Overview

The AGFB006R16A2E3V is an Agilex F Series System on Chip FPGA featuring a Hard Processor System with a quad-core ARM Cortex-A53 MPCore processor running at 1.4 GHz. It integrates 573K logic elements and provides 384 I/Os within a 1546-ball FBGA package. The device supports EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG interfaces.

Feature Summary

  • Integrates a quad-core ARM Cortex-A53 MPCore processor with CoreSight technology
  • Provides 573K logic elements for complex programmable logic applications
  • Supports diverse connectivity including Ethernet, USB OTG, and external memory interfaces

Applications

  • Industrial automation controllers requiring embedded processing and logic flexibility
  • Telecommunications infrastructure equipment utilizing high-speed serial interfaces
  • Medical imaging systems demanding real-time data processing capabilities
  • Automotive infotainment and instrument cluster platforms

Procurement Notes

Verify the specific suffix (E3V) against the manufacturer's current datasheet to confirm pinout compatibility and electrical specifications. Confirm moisture sensitivity level (MSL 3) handling requirements during assembly. Ensure design files are compatible with the latest Quartus Prime software version supporting the Agilex F family.

Selection Notes

Select this component when a balance of moderate logic density (573K LEs) and robust embedded processing is required. Compare against other Agilex F variants based on I/O count (384 vs higher options) and package size (1546 FBGA). Evaluate thermal performance constraints given the 0°C to 100°C junction temperature range.

Part Context

This part belongs to the Agilex F series, designed for cost-sensitive applications requiring ARM processor integration. It shares architectural similarities with the Agilex I series but targets different market segments. The device utilizes Intel's 10nm process technology for improved power efficiency and performance per watt compared to previous generations.

AGFB006R16A2E3VAGFB006R16A2E3V
$6,080.94
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