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The AGFB006R16A3E3E is an Agilex 7 F-Series System-on-Chip FPGA featuring a quad-core ARM Cortex-A53 processor and approximately 573,000 logic elements. It integrates 256KB of RAM and supports speeds up to 1.4GHz. The device includes CoreSight debug infrastructure, NEON SIMD, and floating-point units. It offers extensive connectivity including Ethernet, USB OTG, SPI, I2C, UART, and MMC/SD interfaces. The component operates within a junction temperature range of 0°C to 100°C and utilizes a 1546-ball FBGA package.
Verify the specific suffix codes against official Altera documentation to confirm package type, operating temperature range, and speed grade. Ensure compatibility with required PCB footprint dimensions and thermal management solutions. Confirm moisture sensitivity level handling procedures during assembly. Cross-reference part numbers with current manufacturer availability lists as distribution status may vary by region.
Select this model when a combined CPU and FPGA architecture is necessary for complex system integration. Evaluate the 573K LE capacity against design resource requirements. Consider the 1.4GHz processor speed for application performance needs. Verify that the 1546-ball FBGA package fits the mechanical constraints of the target enclosure and board layout.
This component belongs to the Intel Agilex 7 family, specifically the F-Series designed for high-performance computing and communication applications. It represents a convergence of hard processor systems and flexible programmable logic. The Agilex platform utilizes advanced process technology to deliver high bandwidth and low power consumption compared to previous generations.
Consult official substitution guides for compatible Agilex 7 variants with similar logic densities or package footprints. Verify pin-to-pin compatibility if direct replacement is required. Check for updated speed grades or extended temperature ranges in newer revisions. Ensure software toolchain support remains consistent across potential substitute parts.