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The AGFB006R24C2I1V is an Agilex F-series System-on-Chip FPGA featuring a 573K logic element array. It integrates a quad-core ARM Cortex-A53 processor running at 1.4GHz with NEON and floating-point capabilities. The device utilizes a 2340-ball FBGA package and supports industrial temperature ranges from -40°C to 100°C TJ.
Verify the specific suffix codes against official Altera documentation to confirm package type and temperature grade. Confirm moisture sensitivity level (MSL) handling requirements prior to assembly. Check for any active Process Change Notifications that may affect marking or packaging details.
Select this model when a balance of moderate logic density and embedded processing is required. Compare against the AGFA series if pure FPGA resources are needed without the ARM core. Ensure the 2340-pin footprint fits the target PCB layout constraints.
This component belongs to the Agilex 7 F-Series family, designed for mid-range applications. It sits between lower-density Cyclone devices and higher-end Stratix or Agilex I-series parts. The F-Series emphasizes power efficiency and integrated processing capabilities.