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The AGFB008R16A2I3E is a System on Chip FPGA belonging to the Agilex 7 F-Series device family. Manufactured by Altera, this component integrates hard processor systems with programmable logic fabric. It is housed in a 1546-ball FBGA package designed for surface mount technology applications. The device supports high-density system integration requirements and includes moisture sensitivity characteristics requiring specific handling protocols during assembly.
Verify availability status through authorized distributors as supply may be restricted in certain regions. Confirm RoHS compliance details and moisture sensitivity level ratings prior to procurement. Ensure ordering suffixes match exact package and temperature grade requirements. Cross-reference datasheet revisions to confirm current known issues or errata affecting design implementation.
Select this device for designs requiring integrated processing capabilities alongside flexible FPGA fabric. Evaluate pinout compatibility with existing board layouts due to the 1546-ball FBGA form factor. Consider thermal management solutions appropriate for the package type. Utilize Quartus Prime software for configuration and IP integration within the Agilex 7 ecosystem.
This part belongs to the Agilex 7 family, which represents a significant evolution in FPGA technology from previous generations like Stratix and Arria. The F-Series specifically targets high-performance applications requiring substantial logic density and robust interconnect resources. It complements other Agilex variants such as Agilex 5 and Agilex 3 in the broader product portfolio.