AGFB008R24C3E3E

Overview

The AGFB008R24C3E3E is an Agilex F-series System-on-Chip FPGA featuring a quad-core ARM Cortex-A53 processor and 764K logic elements. It integrates 256KB of RAM, supports 1.4GHz operation, and provides 576 I/Os within a 2340-BGA package. The device operates between 0°C and 100°C junction temperature.

Feature Summary

• Integrated quad-core ARM Cortex-A53 MPCore with CoreSight
• Hybrid architecture combining MPU processing with FPGA fabric
• Support for high-speed interfaces including Ethernet and USB OTG

Applications

• Industrial automation controllers requiring real-time processing
• Network infrastructure equipment with embedded control planes
• Medical imaging systems needing parallel data processing
• Automotive infotainment and instrument clusters

Procurement Notes

Verify the specific suffix codes against official Altera documentation to confirm package type and operating temperature range. Confirm moisture sensitivity level requirements for your assembly process. Check current availability status as distribution may vary by region. Ensure compatibility with Quartus Prime software versions supporting the Agilex F family.

Selection Notes

Select this model when both hard processor system capabilities and flexible programmable logic are required in a single component. Compare logic density against other Agilex F variants to match design complexity. Evaluate thermal performance specifications relative to your enclosure constraints. Verify pinout compatibility if replacing existing designs.

Part Context

This part belongs to the Agilex 7 F-Series, representing Intel's advanced FPGA technology node. It combines traditional FPGA flexibility with embedded processor efficiency. The R24C designation indicates the specific package and speed grade configuration within the broader Agilex portfolio.

Replacement Considerations

Direct replacements must maintain equivalent logic density and processor core compatibility. Consider Agilex F-series variants with similar I/O counts and memory configurations. Verify that alternative packages fit existing board footprints or require redesign. Ensure software toolchain support for any substituted components.