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The AGFB012R24B3E4X is an FPGA from the Agilex 7 F-series, manufactured by Altera. It features 1,178,000 logic elements and operates within a junction temperature range of 0°C to 100°C. The device utilizes a 2340-ball FBGA package with 744 I/Os. It integrates a quad-core ARM Cortex-A53 MPCore processor running at 1.4GHz, equipped with CoreSight technology, ARM NEON, and floating-point capabilities. Embedded RAM size is listed as 0 bit in some specifications, while others indicate 256KB for the SoC variant.
Verify the specific suffix (e.g., E4X vs E3V) against official datasheets to confirm electrical characteristics and package details. Availability may be restricted in certain regions; consult authorized distributors for current status. Ensure moisture sensitivity level (MSL 3) handling protocols are followed during assembly.
Select this component for applications demanding high logic density combined with embedded processing power. Compare the 1.2M LE count against project requirements. Consider the 2340-ball package constraints for PCB layout. Verify thermal management needs given the 0°C to 100°C operating range.
This part belongs to the Agilex 7 F-series, designed for advanced programmable logic and SoC applications. It sits alongside variants like AGFA012R24B3E4X, sharing similar core architecture but potentially differing in packaging or environmental ratings. The series supports extensive IP libraries including Ethernet and PCIe.
It includes a quad-core ARM Cortex-A53 MPCore processor with CoreSight, ARM NEON, and floating-point support.
The device contains 1,178,000 logic elements (LE).
Yes, IBIS models are provided for Agilex 7 devices to support signal integrity and EMC analysis.