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The AGFB012R24C2I3V is an Agilex 7 F-Series System-on-Chip FPGA manufactured by Altera. It integrates a quad-core ARM Cortex-A53 processor with 2.7 million logic elements and supports speeds up to 1.4 GHz. The device features 256 KB of RAM, CoreSight debug capabilities, and NEON SIMD instructions. It includes embedded peripherals such as DMA and WDT, along with connectivity options including Ethernet, USB OTG, SPI, I2C, UART/USART, MMC/SD/SDIO, and EBI/EMI interfaces. The component utilizes a 2340-ball BGA package and operates within a junction temperature range of -40°C to 100°C.
Verify the specific suffix 'I3V' against official datasheets to confirm operating temperature grade and package variant. Confirm moisture sensitivity level (MSL) requirements during storage and handling. Ensure compatibility with Quartus Prime software versions supporting the Agilex 7 family before ordering.
Select this model when both programmable logic resources and embedded ARM processing are required in a single device. Compare the 2.7M LE capacity against application complexity. Verify that the 2340-ball BGA footprint fits the target PCB design constraints and thermal management strategy.
This part belongs to the Agilex 7 F-Series, which targets cost-sensitive applications requiring moderate performance. It sits below higher-end Agilex models in terms of logic density but offers integrated processing capabilities distinct from pure FPGA devices in the same series.
Direct substitutes include other Agilex 7 F-Series variants with similar logic counts, such as AGFA012R24C2I3V or AGFB012R24D2I3V, provided pinout and feature sets match. Cross-series migration requires re-evaluation of architecture and software compatibility.