AGFB012R24C2I3V

AGFB012R24C2I3V

$13,464.07
  • Description:IC FPGA AGILEX-F 2340FBGA
  • Series:Agilex F

SKU:ef9796478c7d Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA AGILEX-F 2340FBGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 1.2M Logic Elements
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:-
  • Supplier Device Package:-

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AGFB012R24C2I3V

Overview

The AGFB012R24C2I3V is an Agilex 7 F-Series System-on-Chip FPGA manufactured by Altera. It integrates a quad-core ARM Cortex-A53 processor with 2.7 million logic elements and supports speeds up to 1.4 GHz. The device features 256 KB of RAM, CoreSight debug capabilities, and NEON SIMD instructions. It includes embedded peripherals such as DMA and WDT, along with connectivity options including Ethernet, USB OTG, SPI, I2C, UART/USART, MMC/SD/SDIO, and EBI/EMI interfaces. The component utilizes a 2340-ball BGA package and operates within a junction temperature range of -40°C to 100°C.

Feature Summary

  • Integrates a quad-core ARM Cortex-A53 MPCore processor with CoreSight debug support
  • Combines 2.7 million logic elements with high-speed processing capabilities
  • Includes extensive peripheral connectivity for diverse system integration needs

Applications

  • High-performance embedded computing systems
  • Industrial automation controllers
  • Telecommunications infrastructure equipment

Procurement Notes

Verify the specific suffix 'I3V' against official datasheets to confirm operating temperature grade and package variant. Confirm moisture sensitivity level (MSL) requirements during storage and handling. Ensure compatibility with Quartus Prime software versions supporting the Agilex 7 family before ordering.

Selection Notes

Select this model when both programmable logic resources and embedded ARM processing are required in a single device. Compare the 2.7M LE capacity against application complexity. Verify that the 2340-ball BGA footprint fits the target PCB design constraints and thermal management strategy.

Part Context

This part belongs to the Agilex 7 F-Series, which targets cost-sensitive applications requiring moderate performance. It sits below higher-end Agilex models in terms of logic density but offers integrated processing capabilities distinct from pure FPGA devices in the same series.

Replacement Considerations

Direct substitutes include other Agilex 7 F-Series variants with similar logic counts, such as AGFA012R24C2I3V or AGFB012R24D2I3V, provided pinout and feature sets match. Cross-series migration requires re-evaluation of architecture and software compatibility.

AGFB012R24C2I3VAGFB012R24C2I3V
$13,464.07
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