AGFB012R24C3E3E

AGFB012R24C3E3E

$9,350.00
  • Description:IC FPGA AGILEX-F 2340FBGA
  • Series:Agilex F

SKU:1db6eb2ab07a Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA AGILEX-F 2340FBGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 1.2M Logic Elements
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:-
  • Supplier Device Package:-

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AGFB012R24C3E3E

Overview

The Altera AGFB012R24C3E3E is a System-on-Chip FPGA belonging to the Agilex F-Series, specifically the AGF012 variant. It integrates programmable logic fabric with embedded processing capabilities. The device features 1,260,000 logic elements and includes an ARM Cortex-A53 processor core operating at 1.4 GHz. It utilizes a 2340-pin FineLine Ball-Grid Array (FBGA) package designed for surface-mount technology. The component supports high-speed I/O standards and includes on-chip memory resources suitable for complex digital signal processing and control applications.

Feature Summary

  • Integrates ARM Cortex-A53 processor cores with FPGA fabric for heterogeneous computing
  • Supports high-performance serial transceivers for data-intensive interfaces
  • Includes comprehensive security features for secure boot and data protection

Applications

  • High-speed networking equipment requiring packet processing
  • Industrial automation controllers with real-time logic requirements
  • Medical imaging systems utilizing parallel data acquisition

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current datasheet to ensure correct package and temperature grade. Confirm RoHS compliance status and moisture sensitivity level prior to PCB assembly planning. Check for any active process change notifications that may affect mechanical dimensions or material composition.

Selection Notes

Compare the 1.26 million logic element capacity against design resource utilization estimates. Ensure the selected package provides sufficient I/O pin count for all interface requirements. Validate thermal performance specifications against the target system's cooling solution constraints.

Part Context

This part belongs to the Intel Agilex 7 family, representing a transition from traditional FPGA architectures to advanced silicon node technologies. The Agilex series combines FPGA flexibility with ASIC-like performance and power efficiency. The AGF012 designation indicates a mid-range density within the F-Series portfolio.

Replacement Considerations

Direct replacements are limited within the same Agilex F-Series family. Consider higher-density models like AGFA022R24C3E3E if additional logic resources are required. Lower-density options such as AGFB006R24C3E3E may suffice for reduced complexity designs.

AGFB012R24C3E3EAGFB012R24C3E3E
$9,350.00
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