AGFB012R24C3E3V

Overview

The Altera AGFB012R24C3E3V is an Agilex 7 F-series System on Chip (SoC) FPGA housed in a 2340-pin FBGA package. It integrates a quad-core ARM Cortex-A53 MPCore processor with CoreSight debug features, NEON SIMD, and floating-point capabilities. The device provides 1.2 million logic elements and operates at speeds up to 1.4 GHz. It includes 256 KB of RAM and supports interfaces such as Ethernet, USB OTG, SPI, I2C, UART/USART, MMC/SD/SDIO, and EBI/EMI. Operating temperatures range from 0°C to 100°C TJ.

Feature Summary

• Integrates a quad-core ARM Cortex-A53 processor with NEON and floating-point support
• Provides high-density programmable logic resources for complex digital designs
• Supports diverse peripheral connectivity including Ethernet and USB OTG
• Includes embedded memory and DMA/WDT peripherals for system efficiency

Applications

• High-performance networking infrastructure equipment
• Industrial automation control systems
• Medical imaging processing units
• Automotive infotainment and telematics modules

Procurement Notes

Verify the specific ordering suffix against official datasheets to confirm package type and temperature grade. Confirm moisture sensitivity level requirements during storage and handling. Ensure compatibility with Quartus Prime software versions supporting the Agilex 7 family. Check for any recent process change notifications affecting pinout or mechanical dimensions before finalizing procurement.

Selection Notes

Select this model when both high-end FPGA fabric capacity and embedded ARM processing are required. Compare logic element counts against alternative Agilex 7 variants to match design complexity. Evaluate power consumption profiles relative to thermal constraints in the target enclosure. Verify that the 2340-pin footprint aligns with existing PCB layout capabilities and assembly equipment.

Part Context

This component belongs to the Intel Agilex 7 F-series, designed for applications requiring significant parallel processing alongside sequential computing tasks. It bridges the gap between traditional FPGAs and general-purpose processors by integrating hardened ARM cores directly into the silicon die.

Replacement Considerations

Direct substitutes within the same series include AGFA012R24C3E3V and AGFA012R24C3E4X. These alternatives share similar logic densities but may differ in specific interface configurations or package options. Verify functional equivalence through detailed datasheet comparison before replacement.