AGFB019R24C2E1V

AGFB019R24C2E1V

$17,907.86
  • Description:AGFB019R24C2E1V
  • Series:Agilex F

SKU:97e4f6ca4fac Category: Brand:

  
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Product Detailed Parameters

  • Description:AGFB019R24C2E1V
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 1.9M Logic Elements
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:2340-BFBGA Exposed Pad
  • Supplier Device Package:2340-BGA (45x42)

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AGFB019R24C2E1V

Overview

The AGFB019R24C2E1V is an Agilex F-series System-on-Chip FPGA manufactured by Altera. It integrates a quad-core ARM Cortex-A53 processor with 1.9 million logic elements. The device operates within a junction temperature range of -40°C to 100°C and utilizes a 3184-BGA package measuring 56x45 mm. Key specifications include 256KB RAM, support for up to 1.4GHz processing speed, and 480 I/Os. Connectivity features encompass EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG.

Feature Summary

  • Integrates a quad-core ARM Cortex-A53 MPCore processor with CoreSight technology
  • Provides 1.9 million adaptive logic modules for complex programmable logic applications
  • Supports high-speed peripheral interfaces including Ethernet and USB OTG

Applications

  • Industrial automation systems requiring embedded control and logic
  • Telecommunications infrastructure utilizing hard processor integration
  • Test and measurement equipment needing high-performance data processing

Procurement Notes

Verify the specific suffix C2E1V against official datasheets to confirm package dimensions and thermal characteristics. Ensure compatibility with existing board layouts due to the 3184-BGA footprint. Confirm moisture sensitivity levels and reflow soldering profiles prior to assembly. Cross-reference manufacturing dates with current product availability notices.

Selection Notes

Select this model when both high-density programmable logic and embedded ARM processing are required in a single component. Compare the 1.9M LE count against project complexity requirements. Evaluate the 3184-BGA package constraints against available PCB space. Consider the integrated memory size relative to application workload demands.

Part Context

This component belongs to the Agilex F series, designed for high-performance computing and connectivity applications. It combines traditional FPGA capabilities with a hardened processor subsystem. The series targets markets demanding low power consumption alongside significant computational throughput.

Replacement Considerations

Check for updated Agilex F-series variants with identical pinouts. Verify functional equivalence if substituting with other 1.9M LE devices. Ensure software toolchain compatibility with Quartus Prime versions supporting this specific silicon revision.

AGFB019R24C2E1VAGFB019R24C2E1V
$17,907.86
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