AGFB019R24C3E4X

AGFB019R24C3E4X

$17,011.97
  • Description:IC FPGA AGILEX-F 2340BGA
  • Series:Agilex F

SKU:6f064aea5254 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA AGILEX-F 2340BGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 1.9M Logic Elements
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:2340-BFBGA Exposed Pad
  • Supplier Device Package:2340-BGA (45x42)

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AGFB019R24C3E4X

Overview

The AGFB019R24C3E4X is an Agilex 7 F-Series System on Chip FPGA manufactured by Altera. It integrates a four-core ARM Cortex-A53 processor with CoreSight technology, supporting NEON and floating-point operations at speeds up to 1.4GHz. The device features approximately 1.9 million logic elements and includes 256KB of embedded RAM. It utilizes a 3184-ball BGA package measuring 56x45mm, offering 480 I/Os. Operating temperatures range from 0°C to 100°C TJ.

Feature Summary

  • Integrates a quad-core ARM Cortex-A53 MPCore processor with NEON and floating-point capabilities
  • Provides high-density programmable logic resources for complex system integration
  • Supports diverse connectivity interfaces including Ethernet, USB OTG, and SPI

Applications

  • High-performance computing systems requiring integrated processing and logic
  • Industrial automation controllers demanding real-time processing
  • Telecommunications infrastructure equipment

Procurement Notes

Verify the specific suffix E4X against official datasheets to confirm package dimensions and pinout compatibility. Ensure that the selected variant matches the required thermal dissipation characteristics for the intended operating environment. Cross-reference the manufacturing date code with current reliability advisories before finalizing procurement orders.

Selection Notes

Compare the 1.9M LE capacity against design resource requirements to ensure sufficient logic utilization. Evaluate the 480 I/O count to verify adequate interface availability for system peripherals. Confirm that the 3184-BGA footprint aligns with existing PCB layout constraints and assembly capabilities.

Part Context

This component belongs to the Agilex 7 F-Series family, designed for scalable performance in demanding applications. It combines hard processor system capabilities with flexible FPGA fabric, enabling heterogeneous computing architectures within a single silicon die for optimized power and area efficiency.

Replacement Considerations

Direct substitutes include other Agilex 7 F-Series variants such as AGFA019R24C3I3E or AGFD019R24C2E4X, provided they match the required logic density and package type. Verify pin-to-pin compatibility and electrical specifications before substitution.

AGFB019R24C3E4XAGFB019R24C3E4X
$17,011.97
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