AGFB019R24C3I3E

AGFB019R24C3I3E

$13,430.93
  • Description:IC FPGA AGILEX-F 2340BGA
  • Series:Agilex F

SKU:1d5c0cba6726 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA AGILEX-F 2340BGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 1.9M Logic Elements
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:2340-BFBGA Exposed Pad
  • Supplier Device Package:2340-BGA (45x42)

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AGFB019R24C3I3E

Overview

The AGFB019R24C3I3E is an Agilex 7 F-Series System on Chip (SoC) FPGA manufactured by Altera. It integrates a 1.9 million logic element FPGA fabric with a quad-core ARM Cortex-A53 processor subsystem featuring CoreSight and NEON capabilities. The device operates at speeds up to 1.4 GHz and includes 256 KB of embedded RAM. It utilizes a 3184-ball BGA package with dimensions of 56x45 mm, offering 480 I/Os. The component supports SMD/SMT mounting and functions within a junction temperature range of -40°C to 100°C.

Feature Summary

  • Integrates a high-density FPGA fabric with 1.9 million logic elements alongside a multi-core ARM processor subsystem.
  • Includes dedicated hardware acceleration features such as ARM NEON and floating-point units within the processor core.
  • Supports extensive connectivity interfaces including Ethernet, USB OTG, SPI, UART, and MMC/SD/SDIO protocols.

Applications

  • High-performance embedded computing systems requiring combined processing and programmable logic.
  • Industrial automation controllers utilizing integrated ARM cores for real-time control.
  • Communication infrastructure equipment leveraging high-speed serial interfaces and FPGA flexibility.

Procurement Notes

Verify the specific suffix codes against official datasheets to confirm package type, temperature grade, and speed bin accuracy. Confirm RoHS compliance status through current manufacturer documentation. Ensure ESD handling procedures are followed due to moisture sensitivity classification. Cross-reference part numbers with authorized distributors to avoid counterfeit components.

Selection Notes

Select this model when a balance of substantial FPGA resources and embedded processing power is required. Compare logic density and processor specifications against alternative Agilex series devices. Evaluate thermal management requirements for the 3184-BGA package in the target application environment. Verify that the available I/O count meets system interface demands.

Part Context

This component belongs to the Agilex 7 F-Series family, designed for applications demanding both high-performance computing and reconfigurable logic. It represents a convergence of traditional FPGA capabilities with embedded processor architectures, targeting complex system integration needs within the Altera product portfolio.

Replacement Considerations

Consult official substitution guides for compatible Agilex 7 variants. Verify pinout compatibility and electrical characteristics before considering alternative part numbers from the same family.

AGFB019R24C3I3EAGFB019R24C3I3E
$13,430.93
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