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The Altera AGFB019R25A1E1V is an Agilex F-Series Field Programmable Gate Array featuring approximately 1.9 million logic elements. It utilizes a 28nm process technology and operates within a junction temperature range of 0°C to 100°C. The device is housed in a 1152-pin FineLine Ball-Grid Array (FBGA) package with flip-chip construction, measuring 30mm by 30mm. This component belongs to the Agilex 7 family and supports high-density programmable logic applications requiring significant computational resources.
Verify the specific ordering suffix against official datasheets to confirm package type and operating temperature range. Confirm moisture sensitivity level requirements during storage and handling. Ensure compatibility with the intended PCB footprint and thermal management solution before procurement.
Select this model when designs require approximately 1.9 million logic elements within the Agilex F-Series ecosystem. Verify that the 1152-pin FBGA package dimensions fit the mechanical constraints. Compare against other Agilex densities if logic requirements exceed or fall below this capacity.
This component is part of the Intel Agilex 7 FPGA portfolio, specifically the F-Series designed for high-performance computing and connectivity. It succeeds previous generations like Arria 10, offering improved performance per watt and higher integration capabilities for modern system-on-chip architectures.
Direct replacements within the same density class include the AGFA019R25A1I1V and AGFC019R25A2E2V. These variants share similar logic element counts but may differ in package options, speed grades, or specific feature sets. Verify pinout compatibility and electrical specifications before substitution.