AGFB019R31C2I3V

Overview

The AGFB019R31C2I3V is an Agilex F Series System-on-Chip FPGA featuring a quad-core ARM Cortex-A53 processor with CoreSight technology, NEON multimedia extensions, and floating-point support. It integrates 1.9 million logic elements within a 3184-ball BGA package measuring 56x45 mm. The device operates at speeds up to 1.4 GHz and includes 256 KB of RAM alongside 480 I/O pins. Peripheral interfaces include DMA and WDT, while connectivity options encompass Ethernet, USB OTG, SPI, UART, I2C, and MMC/SD/SDIO. It supports EBI/EMI memory interfaces and functions within a junction temperature range of -40°C to 100°C.

Feature Summary

• Integrates a quad-core ARM Cortex-A53 MPCore processor with CoreSight debugging capabilities
• Provides 1.9 million logic elements for complex programmable logic applications
• Supports high-speed data processing via ARM NEON and floating-point units
• Offers extensive connectivity through multiple standard serial and parallel interfaces

Applications

• Embedded systems requiring combined processing and programmable logic
• Industrial automation controllers with real-time requirements
• Network infrastructure equipment utilizing Ethernet and peripheral interfaces
• Multimedia processing devices leveraging NEON acceleration

Procurement Notes

Verify the specific suffix codes against official Altera documentation to confirm environmental ratings and package variations. Confirm availability status directly with authorized distributors as lead times may vary. Ensure compatibility with existing board designs regarding the 3184-BGA footprint and pinout definitions before ordering.

Selection Notes

Select this model when both high-performance ARM processing and substantial FPGA fabric are required in a single component. Compare logic element counts and processor specifications against alternative Agilex series parts. Verify that the 3184-BGA package size fits within the mechanical constraints of the target enclosure and PCB layout.

Part Context

This component belongs to the Agilex F Series, designed for applications demanding integrated processing and reconfigurable logic. It shares architectural similarities with other Agilex SoC variants but differs in specific logic density and package configurations. The series targets embedded markets requiring flexible hardware acceleration alongside software execution.

Replacement Considerations

AGFA019R31C2I3V and AGFA019R31C2I1V are functionally similar Agilex F Series SoCs. Verify package markings and environmental grade differences between these part numbers before substitution. Consult official cross-reference guides to ensure pinout and electrical parameter compatibility.