AGFB022R24C3E3E

AGFB022R24C3E3E

$13,970.68
  • Description:IC FPGA AGILEX-F 2340FBGA
  • Series:Agilex F

SKU:fdef132f4ee2 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA AGILEX-F 2340FBGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 2.2M Logic Elements
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:-
  • Supplier Device Package:-

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AGFB022R24C3E3E

Overview

The Altera AGFB022R24C3E3E is a System-on-Chip FPGA belonging to the Agilex 7 F-Series, specifically the AGF022 device family. It integrates programmable logic fabric with embedded processor subsystems on a single die. The component utilizes an FBGA-3184 package for surface-mount installation and is classified as moisture-sensitive. This SoC architecture combines high-density logic resources with processing capabilities, designed for complex system integration requirements within the Agilex portfolio.

Feature Summary

  • Integrates programmable logic fabric with embedded processor cores on a single chip
  • Supports advanced system-level integration through combined FPGA and SoC architectures
  • Utilizes fine-pitch ball-grid array packaging for dense board layouts

Applications

  • High-performance computing infrastructure requiring integrated processing and logic
  • Telecommunications baseband processing systems
  • Industrial automation controllers with mixed-signal requirements

Procurement Notes

Verify the specific ordering suffix against official Intel/Altera documentation to confirm package variant and temperature grade. Ensure compatibility with moisture sensitivity level handling procedures during assembly. Confirm that the selected revision matches the required pinout and electrical specifications for the target design.

Selection Notes

Select this model when both high-density programmable logic and embedded processing are required in a single component. Compare the AGF022 logic capacity against project requirements to ensure adequate resources. Evaluate the FBGA-3184 package constraints regarding board space and thermal dissipation capabilities before finalizing the design.

Part Context

This part belongs to the Agilex 7 F-Series, representing Intel's advanced FPGA technology node. The AGF022 designation indicates the specific logic density tier within the family. As an SoC variant, it differs from pure FPGA models by including integrated hard processor systems, offering a distinct architectural approach compared to standard logic-only devices in the same series.

Replacement Considerations

Direct substitutes must match the Agilex 7 F-Series SoC architecture and FBGA-3184 package. Verify pin-to-pin compatibility if replacing with other AGF022 variants. Consult official cross-reference lists for approved alternative part numbers with identical functional characteristics.

AGFB022R24C3E3EAGFB022R24C3E3E
$13,970.68
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