AGFB022R24C3E4X

Overview

The Altera AGFB022R24C3E4X is a System on Chip FPGA belonging to the Agilex 7 F-Series, specifically the AGF022 device variant. It integrates an ARM Cortex-A53 processor core with programmable logic fabric. The component operates at a maximum frequency of 1.4GHz and features 2.3 million logic elements. It includes 256KB of embedded RAM and supports 744 I/O pins. The device utilizes a 2340-ball FBGA package and functions within a junction temperature range of 0°C to 100°C.

Feature Summary

• Integrates a quad-core ARM Cortex-A53 MPCore processor with NEON and floating-point capabilities
• Provides high-density programmable logic with 2.3 million logic elements
• Supports diverse connectivity interfaces including Ethernet, USB OTG, and SPI

Applications

• High-performance computing systems requiring integrated processing and logic
• Industrial automation controllers with real-time processing needs
• Telecommunications infrastructure equipment

Procurement Notes

Verify the specific suffix E4X against official datasheets to confirm pinout and electrical characteristics. Confirm moisture sensitivity level MSL 3 requirements for storage and handling. Ensure compatibility with Quartus Prime software versions supporting the Agilex 7 family before ordering.

Selection Notes

Compare the 2.3 million logic element capacity against design resource requirements. Evaluate the 1.4GHz operating speed for timing closure feasibility. Assess the 2340-ball FBGA package dimensions for PCB layout constraints and thermal management strategies.

Part Context

This part belongs to the Agilex 7 F-Series, which combines hard processor systems with flexible FPGA fabric. The AGF022 designation indicates the specific logic density tier within this family, offering a balance between processing power and programmability for complex embedded applications.

Replacement Considerations

Check for updated Agilex 7 variants with revised suffixes. Verify cross-compatibility with existing board designs when considering alternative densities within the same package footprint.