AGFB022R24C3I3V

Overview

The AGFB022R24C3I3V is an Agilex 7 F-Series FPGA SoC manufactured by Altera. It belongs to the AGF022 device family and utilizes a 2340-ball FBGA package for surface mount installation. The component is classified under SOC Systems on a Chip within Programmable Logic ICs. Official documentation confirms its moisture sensitivity classification as Yes, requiring appropriate handling during assembly processes.

Feature Summary

• Integrates programmable logic fabric with embedded processor systems on a single chip
• Supports high-density interconnect requirements through a large ball grid array package

Applications

• High-performance computing infrastructure
• Advanced telecommunications equipment
• Industrial automation control systems

Procurement Notes

Verify the specific suffix I3V against official Intel/Altera datasheets to confirm temperature range and packaging details. Confirm RoHS compliance status directly from the manufacturer's current certification documents before procurement. Ensure supply chain sources provide valid traceability records for this Agilex 7 series component.

Selection Notes

Select this model when system design requires the specific logic density of the AGF022 family combined with integrated processing capabilities. Evaluate thermal management solutions suitable for the 2340-ball FBGA footprint. Verify that the target application benefits from the Agilex 7 architecture features rather than alternative FPGA families.

Part Context

This part belongs to the Agilex 7 F-Series product line, representing a generation of high-performance field-programmable gate arrays. The AGF022 designation indicates a specific tier within the family offering defined logic resource counts. It serves as a successor technology to previous Stratix and Arria generations in select market segments.

Replacement Considerations

Consult official Intel substitution guides for verified cross-references. Direct pin-compatible replacements may exist within the same Agilex 7 family with differing speed grades or package options. Validate any substitute against original design constraints.