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The AGFB022R31C2E3VAA is an Agilex 7 FPGA belonging to the F-Series 022 device family. It utilizes a 3184-ball BGA package with dimensions of 56x45 mm. The component operates within a junction temperature range of 0°C to 100°C. This specific part number identifies a programmable logic device designed for high-density system integration, featuring the architectural capabilities inherent to the Agilex 7 F-Series silicon.
Verify the complete part number against official manufacturer documentation to ensure correct suffix interpretation. Confirm package availability and lead times directly with authorized distributors or the manufacturer. Ensure environmental compliance requirements match the specific project constraints before procurement.
Select this component based on the required logic density and I/O count provided by the Agilex 7 F-Series 022 family. Evaluate the 3184-BGA footprint against PCB design constraints. Consider thermal management solutions suitable for the 0°C to 100°C operating range during system design.
This device is part of the Intel (formerly Altera) Agilex 7 portfolio, which integrates advanced process technology with heterogeneous computing elements. The F-Series focuses on high-performance logic and connectivity, serving as a foundational component for next-generation embedded systems requiring scalable programmability.
Direct substitutes are not publicly confirmed for this specific suffix combination. Cross-reference with other Agilex 7 F-Series 022 variants in the same package family, ensuring pin compatibility and functional equivalence through official device data sheets.