AGFB022R31C2E3VAA

AGFB022R31C2E3VAA

$19,068.94
  • Description:IC FPGA AGILEX-F 3184FBGA
  • Series:Agilex F

SKU:bfc6322190ab Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA AGILEX-F 3184FBGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 2.2M Logic Elements
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:-
  • Supplier Device Package:-

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AGFB022R31C2E3VAA

Overview

The AGFB022R31C2E3VAA is an Agilex 7 FPGA belonging to the F-Series 022 device family. It utilizes a 3184-ball BGA package with dimensions of 56x45 mm. The component operates within a junction temperature range of 0°C to 100°C. This specific part number identifies a programmable logic device designed for high-density system integration, featuring the architectural capabilities inherent to the Agilex 7 F-Series silicon.

Feature Summary

  • Agilex 7 F-Series architecture providing high-density programmable logic resources
  • 3184-ball BGA package format supporting complex board layouts
  • Operational reliability defined by specified thermal and electrical boundaries

Applications

  • High-performance networking infrastructure equipment
  • Industrial automation control systems
  • Test and measurement instrumentation

Procurement Notes

Verify the complete part number against official manufacturer documentation to ensure correct suffix interpretation. Confirm package availability and lead times directly with authorized distributors or the manufacturer. Ensure environmental compliance requirements match the specific project constraints before procurement.

Selection Notes

Select this component based on the required logic density and I/O count provided by the Agilex 7 F-Series 022 family. Evaluate the 3184-BGA footprint against PCB design constraints. Consider thermal management solutions suitable for the 0°C to 100°C operating range during system design.

Part Context

This device is part of the Intel (formerly Altera) Agilex 7 portfolio, which integrates advanced process technology with heterogeneous computing elements. The F-Series focuses on high-performance logic and connectivity, serving as a foundational component for next-generation embedded systems requiring scalable programmability.

Replacement Considerations

Direct substitutes are not publicly confirmed for this specific suffix combination. Cross-reference with other Agilex 7 F-Series 022 variants in the same package family, ensuring pin compatibility and functional equivalence through official device data sheets.

AGFB022R31C2E3VAAAGFB022R31C2E3VAA
$19,068.94
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