AGFB022R31C3I3E

Soc System On Chip Overview

The AGFB022R31C3I3E is an Agilex 7 F-Series System-on-Chip FPGA manufactured by Altera. It integrates a quad-core ARM Cortex-A53 processor with CoreSight debug infrastructure, NEON multimedia extensions, and floating-point units. The device features 2.2 million logic elements and operates at speeds up to 1.4 GHz. It includes 256 KB of embedded RAM and supports 720 I/Os. Connectivity options include Ethernet, USB OTG, SPI, UART, I2C, MMC/SD/SDIO, and EBI/EMI interfaces. Peripherals such as DMA and WDT are integrated. The component is housed in a 3184-BGA package and functions within a temperature range of -40°C to 100°C TJ.

Soc System On Chip Feature Summary

• Integrates a quad-core ARM Cortex-A53 MPCore processor with NEON and floating-point capabilities for embedded control tasks.
• Provides 2.2 million logic elements for high-density programmable logic implementation.
• Supports diverse peripheral connectivity including Ethernet, USB OTG, and standard serial interfaces.

Soc System On Chip Applications

• High-performance industrial automation controllers requiring combined processing and logic flexibility.
• Telecommunications infrastructure equipment utilizing embedded Ethernet and high-speed I/O.
• Automotive infotainment or instrument cluster systems demanding robust CPU and FPGA integration.

Soc System On Chip Procurement Notes

Verify the specific suffix codes against official datasheets to confirm package type, temperature grade, and speed bin. Confirm RoHS compliance status and moisture sensitivity level requirements during handling. Ensure compatibility with Quartus Prime software versions supporting the Agilex 7 family before ordering.

Soc System On Chip Selection Notes

Select this model when a combination of significant logic capacity and embedded ARM processing is required. Compare against the Agilex I series if lower power consumption is prioritized over raw performance. Verify that the 3184-BGA footprint fits the target PCB design constraints and thermal management strategy.

Soc System On Chip Part Context

This part belongs to the Agilex 7 F-Series, which focuses on high-performance logic density. It differs from the Agilex I series, which emphasizes power efficiency and embedded security features. Both families share similar packaging options but target distinct market segments regarding performance and power budgets.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements within the same package are limited. Consider the AGIB022R31B3I3E for Agilex I series integration if power efficiency is critical, though architectural differences exist. Evaluate the AGFA027R31C3E3E for higher logic density without embedded processors.