Soc System On Chip AGFB023R24C2E1VB product image

AGFB023R24C2E1VB

$20,966.24
  • Description:IC FPGA AGILEX-F 2340BGA
  • Series:Agilex F

SKU:37fced3fab1f Category: Brand:

  
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AGFB023R24C2E1VB is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA AGILEX-F 2340BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for AGFB023R24C2E1VB

  • Description:IC FPGA AGILEX-F 2340BGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 2.3M Logic Elements
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:2340-BFBGA Exposed Pad
  • Supplier Device Package:2340-BGA (45x42)

Soc System On Chip datasheet and documents for AGFB023R24C2E1VB

AGFB023R24C2E1VB

Soc System On Chip Overview

The AGFB023R24C2E1VB is an Intel Agilex 7 F-Series Field Programmable Gate Array (FPGA) manufactured by Altera. It belongs to the AGF023 device family and features approximately 2.3 million logic elements. The component utilizes a 2340-ball FBGA package with dimensions of 45mm x 45mm. It operates within a junction temperature range of 0°C to 100°C and supports moisture sensitivity level 1. The device integrates high-speed transceivers and programmable I/O interfaces suitable for complex digital logic applications.

Soc System On Chip Feature Summary

  • Integrates approximately 2.3 million logic elements for high-density programmable logic implementation
  • Features a 2340-ball FBGA package designed for surface-mount technology integration
  • Supports operation across a standard commercial temperature range up to 100°C junction temperature

Soc System On Chip Applications

  • High-performance data center acceleration and networking infrastructure
  • Industrial automation and control systems requiring flexible logic processing
  • Test and measurement equipment utilizing high-speed signal processing

Soc System On Chip Procurement Notes

Verify the specific ordering suffix C2E1VB against the manufacturer's current datasheet to confirm package type, speed grade, and environmental compliance. Ensure compatibility with the required PCB footprint and thermal management solutions before procurement. Confirm availability status directly with authorized distributors as supply levels may fluctuate.

Soc System On Chip Selection Notes

Select this model when designing systems requiring approximately 2.3M logic elements within the Agilex 7 F-Series architecture. Ensure the design tool environment, such as Quartus Prime Pro Edition, meets the recommended physical RAM requirements for processing this device size. Verify that the target application fits within the available I/O count and transceiver resources provided by the 2340-ball package.

Soc System On Chip Part Context

This component is part of the Intel Agilex 7 F-Series, which represents a mid-range offering in the Agilex portfolio. It shares architectural similarities with other AGFB023 variants but differs in specific speed grades and packaging configurations. The F-Series focuses on balancing performance and power efficiency for scalable system-on-chip implementations.

Soc System On Chip Replacement Considerations

Direct replacements include other Agilex 7 F-Series devices with similar logic densities, such as AGFA023 or AGFC023 variants, provided pinouts and electrical characteristics are compatible. Cross-family migration to Agilex 5 or Stratix 10 requires significant redesign due to architectural differences.

AGFB023R24C2E1VBAGFB023R24C2E1VB
$20,966.24
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