Soc System On Chip AGFB027R24C2I1VB product image

AGFB027R24C2I1VB

$32,028.09
  • Description:AGFB027R24C2I1VB
  • Series:Agilex F

SKU:d07512001d50 Category: Brand:

  
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AGFB027R24C2I1VB is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is AGFB027R24C2I1VB. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for AGFB027R24C2I1VB

  • Description:AGFB027R24C2I1VB
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 2.7M Logic Elements
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:2340-BFBGA Exposed Pad
  • Supplier Device Package:2340-BGA (45x42)

Soc System On Chip datasheet and documents for AGFB027R24C2I1VB

AGFB027R24C2I1VB

Soc System On Chip Overview

The AGFB027R24C2I1VB is an Agilex F-series System on Chip (SoC) manufactured by Altera. It integrates a Field Programmable Gate Array with 2.7 million logic elements and a quad-core ARM Cortex-A53 processor running at 1.4 GHz. The device features 256 KB of RAM, supports up to 744 I/Os, and includes peripherals such as DMA and WDT. Connectivity options include Ethernet, USB OTG, SPI, UART, I2C, MMC/SD/SDIO, and EBI/EMI. It operates within a junction temperature range of -40°C to 100°C and is housed in a 2340-pin FBGA package.

Soc System On Chip Feature Summary

  • Integrates a quad-core ARM Cortex-A53 MPCore processor with CoreSight technology and floating-point support alongside FPGA fabric.

Soc System On Chip Applications

  • Embedded systems requiring combined processing and programmability

Soc System On Chip Procurement Notes

Verify the specific suffix 'VB' against official manufacturer documentation to confirm its exact meaning regarding package or environmental specifications. Ensure compatibility with required PCB footprint and thermal management solutions for the 2340-ball FBGA configuration before procurement.

Soc System On Chip Selection Notes

Select this component when a high-performance SoC combining ARM processing with significant FPGA resources is required. Consider the 2.7M LE capacity and 1.4GHz processor speed relative to application complexity. Verify that the 2340-pin package fits the design constraints.

Soc System On Chip Part Context

This part belongs to the Agilex F series, specifically the AGF027 variant. It represents a convergence of CPU and FPGA technologies within Intel's advanced semiconductor portfolio, designed for complex embedded applications.

Soc System On Chip Replacement Considerations

Consult official substitution guides for compatible Agilex F-series devices. Verify pinout and feature parity if considering alternatives like AGFA027R24C2I2V.

AGFB027R24C2I1VBAGFB027R24C2I1VB
$32,028.09
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