AGFB027R24C2I3E

Soc System On Chip Overview

The Altera AGFB027R24C2I3E is a System on Chip (SoC) device belonging to the Agilex 7 F-Series, specifically within the AGF027 density class. It integrates a hard processor system featuring a quad-core ARM Cortex-A53 MPCore with CoreSight technology and floating-point support alongside FPGA fabric resources. The device provides approximately 2.7 million logic elements and includes 256KB of embedded RAM. It operates at speeds up to 1.4GHz and supports a wide range of connectivity interfaces including Ethernet, USB OTG, SPI, I2C, UART/USART, MMC/SD/SDIO, and EBI/EMI. The component utilizes a 2340-pin FineLine Ball-Grid Array (FBGA) package suitable for surface mount applications.

Soc System On Chip Feature Summary

• Integrates a quad-core ARM Cortex-A53 hard processor system with NEON and floating-point capabilities
• Provides high-density programmable logic fabric with approximately 2.7 million logic elements
• Supports diverse peripheral connectivity including Ethernet, USB OTG, and standard serial interfaces
• Utilizes a 2340-pin FBGA package designed for high-performance surface-mount integration

Soc System On Chip Applications

• High-performance embedded computing systems requiring combined processing and programmability
• Industrial automation controllers utilizing ARM cores for control and FPGA for real-time tasks
• Communication infrastructure equipment leveraging integrated Ethernet and high-speed interfaces
• Medical imaging devices requiring precise signal processing and data handling

Soc System On Chip Procurement Notes

Verify the specific ordering suffix against official datasheets to confirm package type and temperature grade. Confirm availability status as distribution channels may indicate regional sales restrictions. Ensure compatibility with required PCB footprint dimensions for the 2340-pin FBGA configuration before finalizing procurement orders.

Soc System On Chip Selection Notes

Select this model when application requirements demand significant FPGA logic capacity paired with robust ARM processing power. Consider the 2340-pin package constraints regarding board space and thermal management. Evaluate if the 2.7M LE density meets design complexity needs without over-specifying resources available in lower-density Agilex variants.

Soc System On Chip Part Context

This component is part of the Agilex 7 family, representing a convergence of high-performance FPGA fabric and hardened ARM processors. The AGF027 designation indicates its position within the product line's logic density hierarchy. It serves as a key solution for complex SoC designs requiring both deterministic hardware acceleration and flexible software execution environments.

Soc System On Chip Replacement Considerations

Direct functional substitutes within the same family include AGFB027R24C2I1VB and AGFB027R24C2I2V. These parts share identical core specifications and pinouts but may differ in package options or manufacturing revisions. Verify pin compatibility and electrical characteristics before substituting.