Soc System On Chip AGFB027R24C3E3V product image

AGFB027R24C3E3V

$13,330.57
  • Description:IC FPGA AGILEX-F 2340FBGA
  • Series:Agilex F

SKU:864f6e4896b9 Category: Brand:

  
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AGFB027R24C3E3V is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA AGILEX-F 2340FBGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for AGFB027R24C3E3V

  • Description:IC FPGA AGILEX-F 2340FBGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 2.7M Logic Elements
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:-
  • Supplier Device Package:-

Soc System On Chip datasheet and documents for AGFB027R24C3E3V

AGFB027R24C3E3V

Soc System On Chip Overview

The AGFB027R24C3E3V is a System-on-Chip FPGA from the Intel Agilex 7 F series, featuring approximately 2.7 million logic elements. It integrates a quad-core ARM Cortex-A53 processor running at 1.4 GHz with NEON and floating-point capabilities. The device utilizes a 2340-ball FBGA package and supports industrial operating temperatures ranging from -40°C to 100°C TJ. Key embedded peripherals include DMA controllers, watchdog timers, and interfaces such as Ethernet, USB OTG, SPI, I2C, UART/USART, MMC/SD/SDIO, and EBI/EMI.

Soc System On Chip Feature Summary

  • Integrates a quad-core ARM Cortex-A53 hard processor system with CoreSight debug support
  • Provides high-density programmable fabric with approximately 2.7 million logic elements
  • Supports diverse connectivity through integrated Ethernet, USB OTG, and external memory interfaces

Soc System On Chip Applications

  • High-performance industrial automation systems requiring deterministic processing
  • Telecommunications infrastructure utilizing integrated Ethernet PHY capabilities
  • Embedded computing platforms leveraging combined FPGA flexibility and ARM processing

Soc System On Chip Procurement Notes

Verify component authenticity by cross-referencing the manufacturer part number with official Intel documentation. Confirm that the specific suffix corresponds to the intended temperature grade and package variant. Ensure compliance with RoHS directives and moisture sensitivity levels prior to assembly. Request relevant customer advisories or product change notifications to verify current manufacturing status and any known issues affecting deployment.

Soc System On Chip Selection Notes

Select this model when an Agilex 7 SoC requires a balance of moderate logic density and robust ARM processing power. The 2340-ball package offers extensive I/O availability for complex peripheral integration. Consider thermal management requirements given the 100°C junction temperature rating. Evaluate interface needs against the built-in Ethernet and memory controller options to minimize external component count.

Soc System On Chip Part Context

This component belongs to the Intel Agilex 7 family, representing a transition toward advanced process nodes for high-efficiency computing. The F series specifically targets applications needing significant programmable logic alongside hardened processor subsystems. It succeeds previous generations by offering improved performance per watt and enhanced security features within the same form factor constraints.

Soc System On Chip Replacement Considerations

Direct substitutes within the same package and pinout are limited due to unique die configurations. Alternative selections may require redesigning the PCB layout if using different ball counts. Verify compatibility with existing Quartus Prime software versions and Hard Processor System software drivers before migrating to other Agilex devices.

AGFB027R24C3E3VAGFB027R24C3E3V
$13,330.57
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