SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
AGFB027R24C3E3V is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA AGILEX-F 2340FBGA. Review the specifications below when checking this part for your BOM.
The AGFB027R24C3E3V is a System-on-Chip FPGA from the Intel Agilex 7 F series, featuring approximately 2.7 million logic elements. It integrates a quad-core ARM Cortex-A53 processor running at 1.4 GHz with NEON and floating-point capabilities. The device utilizes a 2340-ball FBGA package and supports industrial operating temperatures ranging from -40°C to 100°C TJ. Key embedded peripherals include DMA controllers, watchdog timers, and interfaces such as Ethernet, USB OTG, SPI, I2C, UART/USART, MMC/SD/SDIO, and EBI/EMI.
Verify component authenticity by cross-referencing the manufacturer part number with official Intel documentation. Confirm that the specific suffix corresponds to the intended temperature grade and package variant. Ensure compliance with RoHS directives and moisture sensitivity levels prior to assembly. Request relevant customer advisories or product change notifications to verify current manufacturing status and any known issues affecting deployment.
Select this model when an Agilex 7 SoC requires a balance of moderate logic density and robust ARM processing power. The 2340-ball package offers extensive I/O availability for complex peripheral integration. Consider thermal management requirements given the 100°C junction temperature rating. Evaluate interface needs against the built-in Ethernet and memory controller options to minimize external component count.
This component belongs to the Intel Agilex 7 family, representing a transition toward advanced process nodes for high-efficiency computing. The F series specifically targets applications needing significant programmable logic alongside hardened processor subsystems. It succeeds previous generations by offering improved performance per watt and enhanced security features within the same form factor constraints.
Direct substitutes within the same package and pinout are limited due to unique die configurations. Alternative selections may require redesigning the PCB layout if using different ball counts. Verify compatibility with existing Quartus Prime software versions and Hard Processor System software drivers before migrating to other Agilex devices.
Explore related parts through Embedded, Integrated Circuits (ICs), all product categories, ChipApex homepage.