AGFB027R31C2E2V

Soc System On Chip Overview

The AGFB027R31C2E2V is an Agilex F Series System-on-Chip FPGA manufactured by Altera. It integrates a hard processor system featuring a quad-core ARM Cortex-A53 MPCore with CoreSight, ARM NEON, and floating-point units. The device provides 2.7 million logic elements and operates at speeds up to 1.4GHz. It includes 256KB of RAM and supports 744 I/Os. The component is housed in a 2340-ball BGA package measuring 38x38mm. It functions within a junction temperature range of -40°C to 100°C.

Soc System On Chip Feature Summary

• Integrates a quad-core ARM Cortex-A53 hard processor system with NEON and floating-point capabilities
• Provides 2.7 million logic elements for complex programmable logic applications
• Supports high-speed connectivity including Ethernet, USB OTG, SPI, and UART interfaces

Soc System On Chip Applications

• Industrial automation controllers requiring mixed processing and logic
• Telecommunications infrastructure equipment
• Medical imaging systems

Soc System On Chip Procurement Notes

Verify the specific suffix C2E2V against official datasheets to confirm the exact speed grade and commercial temperature rating. Confirm the 2340-ball BGA package dimensions match your PCB footprint requirements. Ensure compatibility with the Agilex 7 design software suite before initiating procurement.

Soc System On Chip Selection Notes

Select this model when 2.7M logic elements are required alongside embedded ARM processing. Compare against the AGFA series if industrial temperature ranges (-40°C to 100°C) are not strictly necessary, as the AGFA variant may offer different thermal characteristics. Verify pinout compatibility with existing designs referencing the 2340-BGA form factor.

Soc System On Chip Part Context

This component belongs to the Agilex 7 F-Series family, which combines FPGA fabric with hard processor systems. It shares architectural similarities with the AGFA027R31C2E2VB but differs in package type (2340 vs 3184 balls) and potentially thermal specifications. It is designed for high-performance embedded applications requiring both programmable logic and application processing.

Soc System On Chip Replacement Considerations

The AGFA027R31C2E2VB offers similar logic density but uses a larger 3184-ball package. Direct substitution requires re-evaluation of the PCB layout due to the significant difference in ball count and physical dimensions.