AGFB027R31C3I3E

Soc System On Chip Overview

The AGFB027R31C3I3E is a System-on-Chip FPGA belonging to the Intel Agilex 7 F-Series family. It utilizes a 3184-ball FBGA package and operates within the industrial temperature range. The device integrates a Hard Processor System (HPS) based on an ARM Cortex-A53 core alongside programmable logic fabric. Key specifications include support for high-speed transceivers, embedded memory blocks, and DSP slices. The component is RoHS compliant and features moisture sensitivity classification requiring specific handling protocols during surface mount assembly.

Soc System On Chip Feature Summary

• Integrates ARM Cortex-A53 hard processor system with programmable logic fabric
• Supports high-speed serial communication via integrated transceiver PHYs
• Includes embedded memory resources and digital signal processing capabilities

Soc System On Chip Applications

• High-performance computing infrastructure
• Telecommunications baseband processing
• Industrial automation control systems

Soc System On Chip Procurement Notes

Verify the specific ordering suffix against the official datasheet to ensure correct package type and temperature grade. Confirm that the source document matches the manufacturer's current revision. Check for any product change notifications or known issues lists associated with this specific part number before integration into production designs.

Soc System On Chip Selection Notes

Select this component when a combined processor and FPGA solution is required for complex system integration. Evaluate the available I/O count and transceiver lanes against interface requirements. Consider the thermal performance of the 3184-ball FBGA package and ensure adequate board-level cooling solutions are implemented for sustained operation.

Soc System On Chip Part Context

This part belongs to the Agilex 7 F-Series, designed for high-density applications. It succeeds previous generations by offering improved performance per watt and enhanced security features. The series supports advanced packaging technologies and provides a migration path from older Stratix and Arria families for existing design teams.

Soc System On Chip Replacement Considerations

Consult official Intel migration guides for cross-family compatibility. Verify pin-to-pin equivalence if substituting within the same package family. Ensure software toolchain versions support the target device architecture.