AGFC019R31C3E3E

Soc System On Chip Overview

The AGFC019R31C3E3E is an Agilex F Series System-on-Chip FPGA featuring a hard processor system with a quad-core ARM Cortex-A53 MPCore. It integrates 1.9 million logic elements and operates at speeds up to 1.4 GHz. The device utilizes a 3184-ball BGA package measuring 56x45 mm, providing 480 I/Os. Key specifications include 256 KB of embedded RAM and support for peripherals such as DMA and WDT. Operating temperatures range from 0°C to 100°C TJ.

Soc System On Chip Feature Summary

• Integrates a quad-core ARM Cortex-A53 processor with CoreSight technology
• Combines 1.9M logic elements with hard processor system capabilities
• Supports high-speed connectivity including Ethernet and USB OTG

Soc System On Chip Applications

• High-performance embedded computing systems
• Industrial automation controllers
• Network infrastructure equipment

Soc System On Chip Procurement Notes

Verify the specific suffix codes against official datasheets to confirm package dimensions and temperature ratings. Confirm availability through authorized distributors as lead times may vary. Ensure compatibility with existing board designs regarding the 3184-BGA footprint and pinout requirements before ordering.

Soc System On Chip Selection Notes

Select this model when requiring a balance of FPGA fabric density and integrated ARM processing power. Compare logic element counts against alternative Agilex variants to ensure sufficient resources. Verify that the 3184-BGA package size fits within the mechanical constraints of the target application enclosure.

Soc System On Chip Part Context

This component belongs to the Intel Agilex 7 F-Series family, designed for applications requiring both programmable logic and hardened processor cores. It represents a convergence of FPGA flexibility and SoC efficiency, targeting complex embedded tasks.

Soc System On Chip Replacement Considerations

Direct substitutes within the same series include AGFA019R31C3E3E and AGFA019R31C2E4X. Verify pin-to-pin compatibility and electrical specifications before swapping components in existing designs.