AGFC019R31C3E3V

Soc System On Chip Overview

The AGFC019R31C3E3V is an Agilex F series System on Chip (SoC) FPGA manufactured by Altera. It integrates a hard processor system featuring a quad-core ARM Cortex-A53 MPCore with CoreSight, NEON, and floating-point capabilities alongside programmable logic resources totaling 1.9 million logic elements. The device operates at speeds up to 1.4 GHz and includes 256 KB of RAM. It utilizes a 3184-ball BGA package measuring 56x45 mm with bare pads. The component supports industrial temperature ranges from -40°C to 100°C TJ and provides 480 I/Os with connectivity options including Ethernet, USB OTG, SPI, UART, and MMC/SD.

Soc System On Chip Feature Summary

• Integrates a quad-core ARM Cortex-A53 hard processor system with NEON and floating-point support
• Provides 1.9 million logic elements for complex programmable logic applications
• Supports high-speed peripheral interfaces including Ethernet and USB OTG
• Features a 3184-ball BGA package suitable for dense board layouts

Soc System On Chip Applications

• Industrial automation controllers requiring embedded processing and logic flexibility
• Network infrastructure equipment utilizing integrated Ethernet connectivity
• Medical imaging systems combining signal processing with control logic
• Automotive infotainment and instrument clusters using ARM cores

Soc System On Chip Procurement Notes

Verify the specific suffix E3 against official datasheets to confirm the commercial temperature range variant. Ensure compatibility with the 3184-BGA footprint and bare pad soldering requirements during assembly planning. Confirm moisture sensitivity levels and reflow profiles prior to manufacturing integration.

Soc System On Chip Selection Notes

Select this model when both high-performance ARM processing and substantial FPGA fabric are required in a single package. Compare the 1.9M LE density against lower-tier Agilex models if resource constraints exist. Validate that the 3184-pin count meets the necessary I/O interface requirements for the target application design.

Soc System On Chip Part Context

This part belongs to the Agilex F family, which bridges the gap between traditional FPGAs and SoCs. It shares architectural similarities with the AGFA and AGFB series but offers distinct packaging and thermal characteristics. The Agilex line represents Intel's advanced node technology targeting high-end embedded and networking markets.

Soc System On Chip Replacement Considerations

Direct substitutes include other Agilex F variants such as AGFA019R31C3E3V or AGFB019R31C3E3V depending on the required temperature grade and package availability. Verify pin-to-pin compatibility and software toolchain support before swapping components.