Soc System On Chip AGFC023R24C3E3E product image

AGFC023R24C3E3E

$14,544.39
  • Description:IC FPGA AGILEX-F 2340BGA
  • Series:Agilex F

SKU:73ad4fd46d1c Category: Brand:

  
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AGFC023R24C3E3E is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA AGILEX-F 2340BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for AGFC023R24C3E3E

  • Description:IC FPGA AGILEX-F 2340BGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 2.3M Logic Elements
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:2340-BFBGA Exposed Pad
  • Supplier Device Package:2340-BGA (45x42)

Soc System On Chip datasheet and documents for AGFC023R24C3E3E

AGFC023R24C3E3E

Soc System On Chip Overview

The Altera AGFC023R24C3E3E is an FPGA from the Agilex 7 F-Series, specifically the AGF023 device variant. It features a logic capacity of 2,308,000 Logic Elements (LEs). The component utilizes a Tray packaging format and is classified under Programmable Logic ICs. The manufacturer lists it as an Altera product with the Agilex trademark. Moisture sensitivity is indicated as present for this unit.

Soc System On Chip Feature Summary

  • Field-programmable gate array architecture within the Agilex 7 family
  • High-density logic resource configuration

Soc System On Chip Applications

  • General programmable logic system integration

Soc System On Chip Procurement Notes

Verify availability status directly with authorized distributors or the manufacturer, as current listings indicate restricted sales in certain regions. Confirm RoHS compliance details through official documentation before procurement. Ensure handling procedures account for moisture sensitivity classification during storage and assembly to maintain component integrity.

Soc System On Chip Selection Notes

Select this model when a specific Agilex 7 F-Series device with approximately 2.3 million LEs is required. Verify that the Tray package form factor aligns with manufacturing equipment capabilities. Compare against other AGF023 variants if different speed grades or package types are needed for the target application constraints.

Soc System On Chip Part Context

This component belongs to the Agilex 7 F-Series, which includes devices like AGFD023R24C2E3E and AGFA023R31C3E3E. These parts share the AGF023 core architecture but differ in package types, such as FBGA options, and functional classifications including SoC variants. The series supports high-performance programmable logic designs.

AGFC023R24C3E3EAGFC023R24C3E3E
$14,544.39
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