AGFC023R31C2I1VB

Soc System On Chip Overview

The Altera AGFC023R31C2I1VB is a Field Programmable Gate Array belonging to the Agilex 7 F series. It features 2,308,000 logic elements and utilizes a 3184-ball BGA package with dimensions of 56x45 mm. The device operates within a junction temperature range of 0°C to 100°C and includes moisture sensitivity characteristics. This component is part of the Agilex 7 family designed for high-performance programmable logic applications.

Soc System On Chip Feature Summary

• Integrates a large array of logic elements for complex digital design implementation
• Utilizes a high-density ball grid array package for system board integration
• Supports standard operating temperature ranges for industrial environments

Soc System On Chip Applications

• High-performance programmable logic systems
• Complex digital circuit prototyping
• System-on-Chip FPGA implementations

Soc System On Chip Procurement Notes

Verify the specific suffix I1VB against official Altera documentation to confirm pinout and electrical specifications. Confirm availability status as distribution channels may indicate limited stock or regional restrictions. Ensure compliance with RoHS requirements and moisture sensitivity levels prior to procurement.

Soc System On Chip Selection Notes

Select this model when a high logic element count from the Agilex 7 F series is required. Compare package options and thermal performance against alternative Agilex variants. Validate that the 3184-BGA footprint matches the target PCB design constraints and signal integrity requirements.

Soc System On Chip Part Context

This component belongs to the Altera Agilex 7 F series, which targets high-end FPGA applications. The series offers scalable logic resources and advanced interconnect structures. It is designed to support demanding data processing and acceleration tasks within modern electronic systems.

Soc System On Chip Replacement Considerations

Consult official substitution guides for compatible Agilex 7 devices. Verify pin-to-pin compatibility and functional equivalence before replacing the original component. Ensure that any substitute part meets the same package and thermal specifications.