AGFD019R24C2E1V

Soc System On Chip Overview

The AGFD019R24C2E1V is an Agilex 7 F-Series System on Chip FPGA manufactured by Altera. It utilizes a 2340-ball FBGA package for surface mount installation. The device integrates programmable logic with embedded processing capabilities, functioning as a complete SoC solution. Key attributes include moisture sensitivity classification and RoHS compliance status. The component belongs to the Agilex family, designed for high-performance applications requiring integrated logic and processor cores within a single silicon die.

Soc System On Chip Feature Summary

• Integrates programmable logic fabric with embedded processor subsystems
• Utilizes advanced packaging for high-density interconnects
• Supports system-level integration through combined FPGA and SoC architecture

Soc System On Chip Applications

• High-performance computing systems
• Network infrastructure equipment
• Industrial automation controllers

Soc System On Chip Procurement Notes

Verify the exact suffix configuration against official datasheets before ordering. Confirm availability status with authorized distributors as supply conditions may vary. Ensure compatibility with existing board designs regarding pinout and power requirements. Check for any specific customer advisories or notices related to this part number prior to procurement.

Soc System On Chip Selection Notes

Select this model when both high-end FPGA logic resources and embedded processing are required in a single device. Compare performance metrics against other Agilex 7 variants to ensure adequate resource utilization. Consider thermal management solutions suitable for the FBGA-2340 package. Validate software toolchain support for the specific Agilex 7 F-Series architecture during the design phase.

Soc System On Chip Part Context

This component is part of the Agilex 7 F-Series portfolio, which combines FPGA flexibility with SoC efficiency. The '019' designation indicates the specific size class within the series. The R24C package code defines the physical footprint and ball count. This series targets demanding applications requiring significant parallel processing and data throughput capabilities.

Soc System On Chip Replacement Considerations

Direct substitutes within the same package and functionality must be identified from the Agilex 7 F-Series lineup. Verify pin-to-pin compatibility and electrical characteristics before substitution. Consult official cross-reference guides for approved alternative part numbers. Ensure that any replacement maintains the required logic density and I/O standards.