AGFD023R24C2E3E

Soc System On Chip Overview

The AGFD023R24C2E3E is an Agilex 7 F-Series System on Chip FPGA manufactured by Altera. It utilizes a 2340-ball FBGA package designed for surface-mount installation. The device integrates programmable logic with embedded processor systems, classified under SOC - Systems on a Chip. It supports high-density interconnects and includes moisture sensitivity features requiring specific handling protocols during assembly.

Soc System On Chip Feature Summary

• Integrates programmable logic fabric with embedded processing cores within a single chip architecture
• Utilizes a high-pin-count FBGA package to support complex system-level interconnections
• Designed for surface-mount technology applications requiring robust physical integration

Soc System On Chip Applications

• High-performance computing infrastructure
• Telecommunications network equipment
• Industrial automation control systems

Soc System On Chip Procurement Notes

Verify component authenticity through authorized distribution channels due to restricted supply status in certain regions. Confirm RoHS compliance documentation matches the specific manufacturing batch. Ensure storage conditions adhere to moisture sensitivity level requirements to prevent package damage prior to reflow soldering processes.

Soc System On Chip Selection Notes

Select this model when a combined FPGA and processor solution is required for space-constrained designs. Evaluate the 2340-ball FBGA footprint against available PCB real estate. Consider the Agilex 7 series capabilities for future-proofing memory interfaces and transceiver speeds compared to legacy families.

Soc System On Chip Part Context

This component belongs to the Agilex 7 F-Series family, specifically the AGF023 variant. It represents a generation of devices focusing on high-density logic and integrated SoC capabilities. The part number suffix indicates specific package and temperature grade configurations defined by Altera standards.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements are not publicly confirmed for this specific suffix combination. Engineers should evaluate other Agilex 7 F-Series parts with identical FBGA-2340 footprints and comparable logic density for potential migration paths.