Soc System On Chip AGFD023R24C2I3E product image

AGFD023R24C2I3E

$24,455.40
  • Description:IC FPGA AGILEX-F 2340BGA
  • Series:Agilex F

SKU:fcd5c250faff Category: Brand:

  
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AGFD023R24C2I3E is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA AGILEX-F 2340BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for AGFD023R24C2I3E

  • Description:IC FPGA AGILEX-F 2340BGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 2.3M Logic Elements
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:2340-BFBGA Exposed Pad
  • Supplier Device Package:2340-BGA (45x42)

Soc System On Chip datasheet and documents for AGFD023R24C2I3E

AGFD023R24C2I3E

Soc System On Chip Overview

The AGFD023R24C2I3E is an Agilex 7 F-Series FPGA SoC manufactured by Altera. It utilizes a 2340-ball FBGA package and operates within the industrial temperature range, indicated by the 'I' suffix. The device integrates programmable logic with embedded processor subsystems, supporting complex system-on-chip architectures. Key specifications include high-density logic resources and advanced transceiver capabilities tailored for demanding data center and infrastructure applications.

Soc System On Chip Feature Summary

  • Integrates programmable logic fabric with embedded ARM Cortex-A53 processors for heterogeneous computing
  • Supports high-speed serial connectivity through integrated SerDes transceivers
  • Features advanced security mechanisms including secure boot and hardware root of trust

Soc System On Chip Applications

  • Data center acceleration and networking infrastructure
  • Industrial automation and control systems
  • Telecommunications baseband processing

Soc System On Chip Procurement Notes

Verify component authenticity through authorized Intel/Altera distributors. Confirm moisture sensitivity level (MSL) handling requirements prior to assembly. Ensure packaging integrity matches tray specifications. Validate RoHS compliance documentation against current regulatory standards. Cross-reference ordering part numbers with official datasheets to confirm package and temperature grade accuracy.

Soc System On Chip Selection Notes

Select this model when requiring combined FPGA flexibility and processor performance in a single die. Evaluate pinout compatibility with existing reference designs. Consider thermal management solutions suitable for high-density BGA packages. Verify software toolchain support via Quartus Prime Pro Edition for optimal resource utilization and timing closure.

Soc System On Chip Part Context

This component belongs to the Agilex 7 F-Series, designed for high-performance computing and infrastructure markets. It represents a transition from traditional FPGA-only solutions to integrated SoC architectures, enabling tighter coupling between programmable logic and hard processor systems within the same silicon substrate.

Soc System On Chip Replacement Considerations

Direct substitutes may include other Agilex 7 F-Series variants with adjusted logic density or package size. Verify pin-to-pin compatibility before substitution. Alternative families like Agilex 5 or 3 require significant design rework due to architectural differences.

AGFD023R24C2I3EAGFD023R24C2I3E
$24,455.40
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