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AGFD023R24C2I3E is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA AGILEX-F 2340BGA. Review the specifications below when checking this part for your BOM.
The AGFD023R24C2I3E is an Agilex 7 F-Series FPGA SoC manufactured by Altera. It utilizes a 2340-ball FBGA package and operates within the industrial temperature range, indicated by the 'I' suffix. The device integrates programmable logic with embedded processor subsystems, supporting complex system-on-chip architectures. Key specifications include high-density logic resources and advanced transceiver capabilities tailored for demanding data center and infrastructure applications.
Verify component authenticity through authorized Intel/Altera distributors. Confirm moisture sensitivity level (MSL) handling requirements prior to assembly. Ensure packaging integrity matches tray specifications. Validate RoHS compliance documentation against current regulatory standards. Cross-reference ordering part numbers with official datasheets to confirm package and temperature grade accuracy.
Select this model when requiring combined FPGA flexibility and processor performance in a single die. Evaluate pinout compatibility with existing reference designs. Consider thermal management solutions suitable for high-density BGA packages. Verify software toolchain support via Quartus Prime Pro Edition for optimal resource utilization and timing closure.
This component belongs to the Agilex 7 F-Series, designed for high-performance computing and infrastructure markets. It represents a transition from traditional FPGA-only solutions to integrated SoC architectures, enabling tighter coupling between programmable logic and hard processor systems within the same silicon substrate.
Direct substitutes may include other Agilex 7 F-Series variants with adjusted logic density or package size. Verify pin-to-pin compatibility before substitution. Alternative families like Agilex 5 or 3 require significant design rework due to architectural differences.
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