AGIA035R39A2E1V

Soc System On Chip Overview

The AGIA035R39A2E1V is a Field Programmable Gate Array (FPGA) belonging to the Intel Agilex 7 I series. It features 3,540,000 Logic Elements for high-density logic implementation. The device utilizes an FCBGA package and operates within a commercial temperature range of 0°C to 100°C junction temperature. It supports moisture sensitivity level 3, requiring specific handling during assembly. This component is designed for advanced programmable logic applications requiring significant computational resources.

Soc System On Chip Feature Summary

• High-density logic fabric with millions of logic elements
• Integrated into the Agilex 7 I series architecture
• Supports surface mount installation via FCBGA packaging

Soc System On Chip Applications

• Advanced digital signal processing systems
• High-performance embedded logic control
• Complex data path acceleration

Soc System On Chip Procurement Notes

Verify the exact ordering suffix against official Intel documentation to ensure correct speed grade and package variant. Confirm RoHS compliance status through the manufacturer's current datasheet. Check for any known issues or errata sheets relevant to this specific revision before finalizing procurement plans.

Soc System On Chip Selection Notes

Compare the 3.5 million LE count against project requirements to ensure sufficient capacity. Evaluate the FCBGA package constraints for board layout and thermal management. Consider the Agilex 7 I series ecosystem tools and IP availability for development efficiency.

Soc System On Chip Part Context

This part belongs to the Agilex 7 family, representing a generation of FPGAs integrating heterogeneous compute capabilities. The 'I' designation typically indicates a specific performance or feature subset within the broader Agilex portfolio, focusing on balanced logic density and power efficiency.