AGIB022R31B2I3V

Soc System On Chip Overview

The Altera AGIB022R31B2I3V is an Agilex I Series System on Chip integrating a 2.2M logic element FPGA with a quad-core ARM Cortex-A53 processor running at 1.4GHz. It features 256KB RAM, 720 I/Os, and supports EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. The device operates within a junction temperature range of 0°C to 100°C and utilizes a 3184FBGA package.

Soc System On Chip Feature Summary

• Integrates a quad-core ARM Cortex-A53 MPCore processor with CoreSight technology and floating-point support alongside programmable fabric.

Soc System On Chip Applications

• Industrial automation controllers requiring mixed processing and logic capabilities
• Edge computing nodes utilizing embedded connectivity interfaces
• Infrastructure equipment managing high-speed serial and parallel data streams

Soc System On Chip Procurement Notes

Verify the specific suffix 'I3V' against official manufacturer documentation to confirm the exact operating temperature range and package variant. Ensure compatibility with existing board layouts for the 3184FBGA footprint before ordering. Cross-reference part numbers with authorized distributors to avoid counterfeit components.

Soc System On Chip Selection Notes

Select this model when a balance between moderate logic capacity and robust application processing is required. Consider the 0°C to 100°C thermal rating for standard commercial environments. Evaluate power consumption profiles against available cooling solutions for the dense BGA package.

Soc System On Chip Part Context

This component belongs to the Agilex I series, designed for cost-sensitive applications requiring integrated processing and programmability. It shares architectural similarities with other Agilex devices but offers distinct logic density and interface configurations tailored for specific market segments.

Soc System On Chip Replacement Considerations

Direct substitutes include AGIB022R31A3I3V and AGIB022R31A2E3V. Verify pinout compatibility and thermal specifications before swapping. Alternative series may require significant redesign due to differing architecture or package constraints.